EP 1086262 A1 20010328 - ELECTROPLATING BATHS
Title (en)
ELECTROPLATING BATHS
Title (de)
BAD FÜR DIE ELEKTROBESCHICHTUNG
Title (fr)
BAIN GALVANOPLASTIQUE
Publication
Application
Priority
- US 0007362 W 20000317
- US 27280099 A 19990319
- US 27255199 A 19990319
- US 27311999 A 19990319
- US 27255099 A 19990319
Abstract (en)
[origin: WO0056952A1] The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in various types of electroplating baths (e.g., sulfate, sulfonic acid, fluoroborate, and halide baths) has a number of unexpected benefits including wider useful current density range, improved appearance and in the case of tin improved oxidative stability.
IPC 1-7
C25D 3/04; C25D 3/12; C25D 3/20; C25D 3/22; C25D 3/26; C25D 3/30; C25D 3/34; C25D 3/38; C25D 3/50; C25D 3/56
IPC 8 full level
CPC (source: EP KR)
C25D 3/00 (2013.01 - KR); C25D 3/02 (2013.01 - EP); C25D 3/32 (2013.01 - EP)
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
WO 0056952 A1 20000928; AU 3632100 A 20001009; AU 773971 B2 20040610; EP 1086262 A1 20010328; EP 1086262 A4 20020102; JP 2002540291 A 20021126; KR 100840451 B1 20080620; KR 20010043710 A 20010525
DOCDB simple family (application)
US 0007362 W 20000317; AU 3632100 A 20000317; EP 00915016 A 20000317; JP 2000606810 A 20000317; KR 20007012945 A 20001117