EP 1086484 A4 20030806 - SLURRY FOR CHEMICAL-MECHANICAL POLISHING METAL SURFACES
Title (en)
SLURRY FOR CHEMICAL-MECHANICAL POLISHING METAL SURFACES
Title (de)
AUFSCHLÄMMUNG ZUM CHEMISCH-MECHANISCHEN POLIEREN VON METALLISCHEN OBERFLÄCHEN
Title (fr)
PATE SERVANT A EFFECTUER LE POLISSAGE CHIMIOMECANIQUE DE SURFACES METALLIQUES
Publication
Application
Priority
- US 9907482 W 19990405
- US 5861898 A 19980410
- US 27745499 A 19990326
Abstract (en)
[origin: WO9953532A1] The present invention provides a slurry for chemical-mechanical polishing metal surfaces which significantly increases the removal rate and is capable of polishing metals which are inert to most common oxidizing agents. The slurry is particularly useful for polishing metal layers on semiconductor wafer substrates. The slurry includes water, abrasive particles, and an oxidizing solution. In one preferred embodiment, the oxidizing solution comprises one or more water soluble peroxides, one or more amino acids, and one or more metals and/or compounds containing metals selected from the group consisting of chromium, cobalt, copper, iron, lead, nickel, palladium, rhodium, samarium, and scandium, with copper being preferred. In another preferred embodiment, the oxidizing solution comprises one or more water soluble peroxides, one or more organic amines, and optionally one or more metals and/or compounds containing metals.
IPC 1-7
H01L 21/00; B44C 1/22; C09G 1/00; C09G 1/02; C09K 3/14; H01L 21/321
IPC 8 full level
C09G 1/00 (2006.01); C09G 1/02 (2006.01); C09K 3/14 (2006.01); H01L 21/304 (2006.01); H01L 21/321 (2006.01)
CPC (source: EP KR)
C09G 1/02 (2013.01 - EP); C09K 3/1463 (2013.01 - EP); H01L 21/302 (2013.01 - KR); H01L 21/3212 (2013.01 - EP)
Citation (search report)
- [X] US 5575885 A 19961119 - HIRABAYASHI HIDEAKI [JP], et al
- [PX] US 5770095 A 19980623 - SASAKI YASUTAKA [JP], et al
- [PX] US 5783489 A 19980721 - KAUFMAN VLASTA BRUSIC [US], et al
- [PX] EP 0846742 A2 19980610 - CABOT CORP [US]
- See references of WO 9953532A1
Designated contracting state (EPC)
DE ES FR GB IT
DOCDB simple family (publication)
WO 9953532 A1 19991021; EP 1086484 A1 20010328; EP 1086484 A4 20030806; JP 2002511650 A 20020416; KR 20010042616 A 20010525
DOCDB simple family (application)
US 9907482 W 19990405; EP 99916387 A 19990405; JP 2000544000 A 19990405; KR 20007011294 A 20001010