Global patent index - EP 1086492 A1

EP 1086492 A1 2001-03-28 - METHOD FOR MAKING A MICROMODULE AND A STORAGE MEDIUM COMPRISING SUCH A MICROMODULE

Title (en)

METHOD FOR MAKING A MICROMODULE AND A STORAGE MEDIUM COMPRISING SUCH A MICROMODULE

Title (de)

HERSTELLUNGSVERFAHREN EINES MIKROMODULES UND SPEICHER DIESES VERWENDEND

Title (fr)

PROCEDE DE FABRICATION D'UN MICROMODULE ET D'UN SUPPORT DE MEMORISATION COMPORTANT UN TEL MICROMODULE

Publication

EP 1086492 A1 (FR)

Application

EP 99918061 A

Priority

  • FR 9901142 W
  • FR 9806683 A

Abstract (en)

[origin: FR2779272A1] The invention concerns a method for making a micromodule comprising an integrated circuit chip provided with bump contacts electrically connected to contact pads, via strip conductors. Said method comprises the following stages: producing, on an insulating material strip, an electrically conductive print to form a recurring pattern formed by the contact pads and the strip conductors; then in any sequence: transferring the integrated circuit chip onto the previously printed pattern; cutting out the pattern so as to separate it from the rest of the strip, in order to obtain an insulating substrate forming the micromodule medium; coating the chip in a protective resin. The resulting micromodule is designed to be inserted in a chip card-type storage medium. Said method is, moreover, quick and enables to produce continuously micromodules inexpensively.

IPC 1-7 (main, further and additional classification)

H01L 23/498; G06K 19/077

IPC 8 full level (invention and additional information)

G06K 19/077 (2006.01); H01L 21/60 (2006.01); H01L 23/498 (2006.01)

CPC (invention and additional information)

H01L 24/85 (2013.01); G06K 19/07745 (2013.01); H01L 23/49855 (2013.01); H01L 24/24 (2013.01); H01L 24/82 (2013.01); H01L 24/48 (2013.01); H01L 2224/24051 (2013.01); H01L 2224/24105 (2013.01); H01L 2224/24226 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48228 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/76155 (2013.01); H01L 2224/82102 (2013.01); H01L 2224/85 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01039 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01058 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/014 (2013.01); H01L 2924/14 (2013.01); H01L 2924/181 (2013.01)

Combination set (CPC)

  1. H01L 2224/48091 + H01L 2924/00014
  2. H01L 2924/00014 + H01L 2224/78
  3. H01L 2924/00014 + H01L 2224/45099
  4. H01L 2924/181 + H01L 2924/00012

Citation (search report)

See references of WO 9962118A1

Designated contracting state (EPC)

DE ES GB IT

EPO simple patent family

FR 2779272 A1 19991203; FR 2779272 B1 20011012; AU 3611699 A 19991213; CN 1303521 A 20010711; EP 1086492 A1 20010328; WO 9962118 A1 19991202

INPADOC legal status

2003-11-26 [18W] WITHDRAWN

- Ref Legal Event Code: 18W

- Effective date: 20030926

2001-03-28 [17P] REQUEST FOR EXAMINATION FILED

- Ref Legal Event Code: 17P

- Effective date: 20001227

2001-03-28 [AK] DESIGNATED CONTRACTING STATES:

- Ref Legal Event Code: AK

- Designated State(s): DE ES GB IT