EP 1086492 A1 20010328 - METHOD FOR MAKING A MICROMODULE AND A STORAGE MEDIUM COMPRISING SUCH A MICROMODULE
Title (en)
METHOD FOR MAKING A MICROMODULE AND A STORAGE MEDIUM COMPRISING SUCH A MICROMODULE
Title (de)
HERSTELLUNGSVERFAHREN EINES MIKROMODULES UND SPEICHER DIESES VERWENDEND
Title (fr)
PROCEDE DE FABRICATION D'UN MICROMODULE ET D'UN SUPPORT DE MEMORISATION COMPORTANT UN TEL MICROMODULE
Publication
Application
Priority
- FR 9901142 W 19990512
- FR 9806683 A 19980527
Abstract (en)
[origin: FR2779272A1] The invention concerns a method for making a micromodule comprising an integrated circuit chip provided with bump contacts electrically connected to contact pads, via strip conductors. Said method comprises the following stages: producing, on an insulating material strip, an electrically conductive print to form a recurring pattern formed by the contact pads and the strip conductors; then in any sequence: transferring the integrated circuit chip onto the previously printed pattern; cutting out the pattern so as to separate it from the rest of the strip, in order to obtain an insulating substrate forming the micromodule medium; coating the chip in a protective resin. The resulting micromodule is designed to be inserted in a chip card-type storage medium. Said method is, moreover, quick and enables to produce continuously micromodules inexpensively.
IPC 1-7
IPC 8 full level
G06K 19/077 (2006.01); H01L 21/60 (2006.01); H01L 23/498 (2006.01)
CPC (source: EP)
G06K 19/07745 (2013.01); H01L 23/49855 (2013.01); H01L 24/24 (2013.01); H01L 24/82 (2013.01); H01L 24/85 (2013.01); H01L 24/48 (2013.01); H01L 2224/24051 (2013.01); H01L 2224/24105 (2013.01); H01L 2224/24226 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48228 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/76155 (2013.01); H01L 2224/82102 (2013.01); H01L 2224/85 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01039 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01058 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/014 (2013.01); H01L 2924/14 (2013.01); H01L 2924/181 (2013.01)
Citation (search report)
See references of WO 9962118A1
Designated contracting state (EPC)
DE ES GB IT
DOCDB simple family (publication)
FR 2779272 A1 19991203; FR 2779272 B1 20011012; AU 3611699 A 19991213; CN 1303521 A 20010711; EP 1086492 A1 20010328; WO 9962118 A1 19991202
DOCDB simple family (application)
FR 9806683 A 19980527; AU 3611699 A 19990512; CN 99806708 A 19990512; EP 99918061 A 19990512; FR 9901142 W 19990512