EP 1088337 A1 20010404 - SEMICONDUCTOR WAFER CLEANING APPARATUS AND METHOD
Title (en)
SEMICONDUCTOR WAFER CLEANING APPARATUS AND METHOD
Title (de)
VORRICHTUNG UND VERFAHREN ZUR REINIGUNG VON HALBLEITERWAFERN
Title (fr)
APPAREIL ET PROCEDE DE NETTOYAGE DE PLAQUETTE EN SEMI-CONDUCTEUR
Publication
Application
Priority
- US 0007394 W 20000320
- US 28161999 A 19990330
Abstract (en)
[origin: WO0059006A1] A cleaning apparatus for removing contaminants from the surface of a semiconductor wafer. A megasonic nozzle and a scrubbing brush are included in the cleaning apparatus. The megasonic nozzle is adapted for outputting megasonically agitated fluid to dislodge contaminant particles from a surface of a semiconductor wafer. The scrubbing brush is adapted to contact the surface of the semiconductor wafer and frictionally remove therefrom the contaminant particles. The megasonic nozzle and the scrubbing brush are both mounted within a cleaning assembly. The cleaning assembly simultaneously employs both the megasonic nozzle and brush to efficiently clean the contaminant particles from the surface of the semiconductor wafer.
IPC 1-7
IPC 8 full level
H01L 21/306 (2006.01); H01L 21/00 (2006.01); H01L 21/304 (2006.01)
CPC (source: EP KR)
H01L 21/304 (2013.01 - KR); H01L 21/67046 (2013.01 - EP); H01L 21/67051 (2013.01 - EP)
Citation (search report)
See references of WO 0059006A1
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
WO 0059006 A1 20001005; AU 3903000 A 20001016; CN 1310860 A 20010829; EP 1088337 A1 20010404; JP 2002540623 A 20021126; KR 20010052451 A 20010625
DOCDB simple family (application)
US 0007394 W 20000320; AU 3903000 A 20000320; CN 00800942 A 20000320; EP 00918167 A 20000320; JP 2000608416 A 20000320; KR 20007013477 A 20001129