EP 1089101 A8 20021218 - Opto-electronic hybrid integration platform, optical sub-module, opto-electronic hybrid integration circuit, and process for fabricating platform
Title (en)
Opto-electronic hybrid integration platform, optical sub-module, opto-electronic hybrid integration circuit, and process for fabricating platform
Title (de)
Optoelektronische Hybridintegrationsplattform, optisches Untermodul, optoelektronische hybridintegrierte Schaltung, und Herstellungsverfahren der Plattform
Title (fr)
Plate-form pour intégration optoélectronique hybride, sous-module optique, circuit intégré de type hybride optélectronique, et procédé de fabrication de la plate-form
Publication
Application
Priority
- EP 97121103 A 19940808
- EP 94112361 A 19940808
- JP 19732593 A 19930809
- JP 30657893 A 19931207
- JP 10649294 A 19940520
- JP 14822294 A 19940629
Abstract (en)
[origin: EP0638829A1] An opto-electronic hybrid integrated circuit of the present invention satisfy a low-loss optical waveguide function, an optical bench function and a high-frequency electrical wiring function. The circuit includes a silicon substrate (1), an optical waveguide part (I) arranged in a recess of the substrate (1), and an optical device mounting part (II) formed on a protrusion (52) of the substrate (1). An optical device (37) is mounted on an optical sub-module (44). This sub-module (44) is placed on the protrusion (52). An electrical wiring part is disposed on another protrusion 35 of the substrate (1). <IMAGE>
IPC 1-7
IPC 8 full level
G02B 6/42 (2006.01); H01S 5/02 (2006.01); H01S 5/062 (2006.01); H01S 5/20 (2006.01)
CPC (source: EP US)
G02B 6/42 (2013.01 - EP US); G02B 6/4224 (2013.01 - EP US); G02B 6/4227 (2013.01 - EP US); G02B 6/4232 (2013.01 - EP US); G02B 6/421 (2013.01 - EP US); G02B 6/4219 (2013.01 - EP US); G02B 6/4225 (2013.01 - EP US); G02B 6/423 (2013.01 - EP US); G02B 6/4238 (2013.01 - EP US); G02B 6/4249 (2013.01 - EP US); H01L 2224/45144 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2924/13055 (2013.01 - EP US); H01L 2924/13091 (2013.01 - EP US); H01L 2924/19107 (2013.01 - EP US); H01L 2924/3011 (2013.01 - EP US); H01S 5/021 (2013.01 - EP US); H01S 5/06226 (2013.01 - EP US); H01S 5/2068 (2013.01 - EP US)
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
EP 0638829 A1 19950215; EP 0638829 B1 19991124; CA 2129762 A1 19950210; CA 2129762 C 19991207; DE 69421767 D1 19991230; DE 69421767 T2 20000531; DE 69431809 D1 20030109; DE 69431809 T2 20030410; DE 69434104 D1 20041202; DE 69434104 T2 20051103; DE 69434105 D1 20041202; DE 69434105 T2 20051020; EP 0831349 A2 19980325; EP 0831349 A3 19980401; EP 0831349 B1 20021127; EP 1083450 A1 20010314; EP 1083450 B1 20041027; EP 1089101 A1 20010404; EP 1089101 A8 20021218; EP 1089101 B1 20041027; US 5621837 A 19970415; US 6027254 A 20000222; US 6164836 A 20001226
DOCDB simple family (application)
EP 94112361 A 19940808; CA 2129762 A 19940809; DE 69421767 T 19940808; DE 69431809 T 19940808; DE 69434104 T 19940808; DE 69434105 T 19940808; EP 00123647 A 19940808; EP 00123651 A 19940808; EP 97121103 A 19940808; US 28696894 A 19940808; US 37581199 A 19990817; US 69462096 A 19960809