Global Patent Index - EP 1089400 A2

EP 1089400 A2 20010404 - Connector with primary molded member and secondary molded member

Title (en)

Connector with primary molded member and secondary molded member

Title (de)

Verbinder mit einem ersten und einem zweiten Formteil

Title (fr)

Connecteur avec une première et une deuxième pièce moulée

Publication

EP 1089400 A2 20010404 (EN)

Application

EP 00710023 A 20000928

Priority

JP 27909799 A 19990930

Abstract (en)

In a connector with a primary molded member (50) and a secondary molded member (60), a distance (D) between the primary molded member and a die (70) is set before a filling of a secondary resin so that a melting protrusion (53) of the primary molded member is melted by a secondary resin having a predetermined temperature and a predetermined pressure during the filling of the secondary resin. Because a wall thickness of the secondary molded member around the primary molded member is made approximately uniform, a flow rate of the secondary resin is increased. Further, the melting protrusion is disposed to partition electrical conductive members from each other, and is accurately sufficiently melted to improve fusion-bonding performance between the primary molded member and the secondary molded member. Accordingly, an electrical short circuit between the electrical conductive members is accurately prevented in the connector. <IMAGE>

IPC 1-7

H01R 43/24

IPC 8 full level

B29C 45/14 (2006.01); F02M 51/06 (2006.01); F16K 31/00 (2006.01); H01R 13/516 (2006.01); H01R 43/18 (2006.01); H01R 43/24 (2006.01); H01R 13/405 (2006.01)

CPC (source: EP)

H01R 43/24 (2013.01); H01R 13/405 (2013.01)

Designated contracting state (EPC)

DE ES FR GB IT

DOCDB simple family (publication)

EP 1089400 A2 20010404; EP 1089400 A3 20020417; EP 1089400 B1 20071114; DE 60037090 D1 20071227; DE 60037090 T2 20080911; ES 2292420 T3 20080316; JP 2001102124 A 20010413; JP 4186145 B2 20081126

DOCDB simple family (application)

EP 00710023 A 20000928; DE 60037090 T 20000928; ES 00710023 T 20000928; JP 27909799 A 19990930