Global Patent Index - EP 1090057 A1

EP 1090057 A1 2001-04-11 - REWORKABLE THERMOSETTING RESIN COMPOSITIONS

Title (en)

REWORKABLE THERMOSETTING RESIN COMPOSITIONS

Title (de)

WIEDERVERARBEITBARE WÄRMEHÄRTBARE HARZZUSAMMENSETZUNGEN

Title (fr)

COMPOSITIONS DE RESINE THERMODURCISSABLES REMANIABLES

Publication

EP 1090057 A1 (EN)

Application

EP 00916567 A

Priority

  • US 0007452 W
  • US 27494399 A

Abstract (en)

[origin: WO0056799A1] This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages ("CSPs"), ball grid arrays ("BGAs"), and the like, each of which having a semiconductor chip, such as large scale integration ("LSI"), on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.

IPC 1-7 (main, further and additional classification)

C08G 59/24; H01L 21/56

IPC 8 full level (invention and additional information)

C08K 3/00 (2006.01); C08G 59/22 (2006.01); C08G 59/24 (2006.01); C08G 59/40 (2006.01); C08L 63/00 (2006.01); C08L 79/00 (2006.01); H01L 21/56 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01)

CPC (invention and additional information)

H01L 24/29 (2013.01); C08G 59/24 (2013.01); C08L 63/00 (2013.01); H01L 21/563 (2013.01); H01L 24/83 (2013.01); H01L 24/98 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73203 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/83192 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01018 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01067 (2013.01); H01L 2924/01075 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/12033 (2013.01); H01L 2924/14 (2013.01); H01L 2924/19042 (2013.01)

Combination set (CPC)

  1. H01L 2224/73204 + H01L 2224/16225 + H01L 2224/32225 + H01L 2924/00
  2. H01L 2224/83192 + H01L 2224/32225 + H01L 2924/00
  3. H01L 2924/3512 + H01L 2924/00
  4. H01L 2224/83192 + H01L 2224/73204 + H01L 2224/16225 + H01L 2224/32225 + H01L 2924/00
  5. H01L 2924/12033 + H01L 2924/00
  6. H01L 2924/00014 + H01L 2224/0401

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

EPO simple patent family

WO 0056799 A1 20000928; AU 3765600 A 20001009; CA 2331790 A1 20000928; CN 1300301 A 20010620; EP 1090057 A1 20010411; JP 2002540235 A 20021126; MX PA00011554 A 20011202

INPADOC legal status


2004-09-29 [18D] DEEMED TO BE WITHDRAWN

- Effective date: 20040325

2003-07-16 [RAP1] TRANSFER OF RIGHTS OF AN EP PUBLISHED APPLICATION

- Owner name: HENKEL LOCTITE CORPORATION

2003-05-07 [17Q] FIRST EXAMINATION REPORT

- Effective date: 20030321

2001-04-11 [17P] REQUEST FOR EXAMINATION FILED

- Effective date: 20001030

2001-04-11 [AK] DESIGNATED CONTRACTING STATES:

- Kind Code of Ref Document: A1

- Designated State(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

2001-04-11 [AX] REQUEST FOR EXTENSION OF THE EUROPEAN PATENT TO

- Free text: AL;LT;LV;MK;RO;SI