EP 1090057 A1 20010411 - REWORKABLE THERMOSETTING RESIN COMPOSITIONS
Title (en)
REWORKABLE THERMOSETTING RESIN COMPOSITIONS
Title (de)
WIEDERVERARBEITBARE WÄRMEHÄRTBARE HARZZUSAMMENSETZUNGEN
Title (fr)
COMPOSITIONS DE RESINE THERMODURCISSABLES REMANIABLES
Publication
Application
Priority
- US 0007452 W 20000322
- US 27494399 A 19990323
Abstract (en)
[origin: WO0056799A1] This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages ("CSPs"), ball grid arrays ("BGAs"), and the like, each of which having a semiconductor chip, such as large scale integration ("LSI"), on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.
IPC 1-7
IPC 8 full level
C08G 59/22 (2006.01); C08G 59/24 (2006.01); C08G 59/40 (2006.01); C08K 3/00 (2006.01); C08L 63/00 (2006.01); C08L 79/00 (2006.01); H01L 21/56 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01)
CPC (source: EP KR)
C08G 59/24 (2013.01 - EP); C08L 63/00 (2013.01 - EP); H01L 21/56 (2013.01 - KR); H01L 21/563 (2013.01 - EP); H01L 24/29 (2013.01 - EP); H01L 24/83 (2013.01 - EP); H01L 24/98 (2013.01 - EP); H01L 2224/16225 (2013.01 - EP); H01L 2224/32225 (2013.01 - EP); H01L 2224/73203 (2013.01 - EP); H01L 2224/73204 (2013.01 - EP); H01L 2224/83192 (2013.01 - EP); H01L 2924/00014 (2013.01 - EP); H01L 2924/01005 (2013.01 - EP); H01L 2924/01006 (2013.01 - EP); H01L 2924/01013 (2013.01 - EP); H01L 2924/01015 (2013.01 - EP); H01L 2924/01018 (2013.01 - EP); H01L 2924/01019 (2013.01 - EP); H01L 2924/01023 (2013.01 - EP); H01L 2924/01027 (2013.01 - EP); H01L 2924/01033 (2013.01 - EP); H01L 2924/01067 (2013.01 - EP); H01L 2924/01075 (2013.01 - EP); H01L 2924/01082 (2013.01 - EP); H01L 2924/12033 (2013.01 - EP); H01L 2924/14 (2013.01 - EP); H01L 2924/19042 (2013.01 - EP)
Citation (search report)
See references of WO 0056799A1
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
WO 0056799 A1 20000928; AU 3765600 A 20001009; CA 2331790 A1 20000928; CN 1300301 A 20010620; EP 1090057 A1 20010411; JP 2002540235 A 20021126; KR 20010043524 A 20010525; MX PA00011554 A 20011202
DOCDB simple family (application)
US 0007452 W 20000322; AU 3765600 A 20000322; CA 2331790 A 20000322; CN 00800298 A 20000322; EP 00916567 A 20000322; JP 2000606659 A 20000322; KR 20007012625 A 20001111; MX PA00011554 A 20001123