EP 1090422 A1 20010411 - METHOD FOR PRODUCING THIN SUBSTRATE LAYERS
Title (en)
METHOD FOR PRODUCING THIN SUBSTRATE LAYERS
Title (de)
VERFAHREN ZUR FERTIGUNG VON DÜNNEN SUBSTRATSCHICHTEN
Title (fr)
PROCEDE POUR LA PRODUCTION DE COUCHES DE SUBSTRAT MINCES
Publication
Application
Priority
- DE 9901826 W 19990622
- DE 19827717 A 19980622
Abstract (en)
[origin: DE19840421A1] A thin substrate layer is produced from two bonded substrates (1, 2) having interface channel recesses (5) for etchant penetration. A thin substrate layer is produced by: (a) bonding two substrate front faces using one or more intermediate bonding layers (3, 4), at least one of the bonding layers or the front face of one of the substrates (1, 2) having channel-like recesses (5) which allow sideways penetration of an etchant; (b) thinning one substrate (1) down to a substrate layer (1a); and (c) detaching the substrate layer from the other substrate (2) by introducing etchant into the recesses. An Independent claim is also included for a substrate structure resulting from step (a) of the above process.
IPC 1-7
IPC 8 full level
H01L 21/306 (2006.01); H01L 21/20 (2006.01); H01L 21/301 (2006.01); H01L 21/3063 (2006.01)
CPC (source: EP US)
H01L 21/2007 (2013.01 - EP US); H01L 21/3063 (2013.01 - EP US); H01L 2221/68363 (2013.01 - EP US); Y10S 438/967 (2013.01 - EP US)
Designated contracting state (EPC)
DE FR IT
DOCDB simple family (publication)
DE 19840421 A1 19991223; DE 19840421 C2 20000531; EP 1090422 A1 20010411; JP 2002519847 A 20020702; US 6417075 B1 20020709; WO 9967820 A1 19991229
DOCDB simple family (application)
DE 19840421 A 19980904; DE 9901826 W 19990622; EP 99939373 A 19990622; JP 2000556397 A 19990622; US 72015401 A 20010322