EP 1090535 A1 20010411 - FLIP CHIP DEVICES WITH FLEXIBLE CONDUCTIVE ADHESIVE
Title (en)
FLIP CHIP DEVICES WITH FLEXIBLE CONDUCTIVE ADHESIVE
Title (de)
FLIP-CHIP-ANORDNUNGEN MIT FLEXIBLEN LEITFAHIGEN KLEBSTOFF
Title (fr)
DISPOSITIFS A PUCES A PROTUBERANCES COMPRENANT UNE COLLE CONDUCTRICE SOUPLE
Publication
Application
Priority
- US 9908787 W 19990422
- US 8288598 P 19980424
- US 8332698 P 19980428
- US 9214798 P 19980709
- US 16663398 A 19981005
- US 27625999 A 19990325
Abstract (en)
[origin: WO9956509A1] An electronic device (10, 100) includes one or more semiconductor chips (30, 130) interconnected to a next level substrate (20, 120) in a flip chip manner using flexible conductive adhesive (40, 140) having a low modulus of elasticity. The flexible conductive adhesive (40, 140) is applied as conductive bumps (40, 140) on the contact pads (24, 124) of the substrate (20, 120) or on the contact pads (34, 134) of the semiconductor chips (30, 130) and is a flexible thermoplastic or thermosetting resin filled with electrically-conductive particles. Other electronic devices (44, 46, 144, 146), such as packaged components including resistors, capacitors and the like, are bonded with the same flexible conductive adhesive bump (24, 124, 34, 134) approach as is employed for the semiconductor chips (30, 130). The contact pads of both the chip (30, 130) and the next level substrate (20, 120) are preferably passivated with a metallic coating (38), preferably a precious metal, prior to interconnection to inhibit oxidation of the pads (37). A flexible insulating organic underfill (150) may be used, preferably one having substantially the same low modulus of elasticity as that of the flexible conductive adhesive (40, 140).
IPC 1-7
IPC 8 full level
H01L 21/60 (2006.01); H05K 1/18 (2006.01); H05K 3/32 (2006.01); H05K 3/24 (2006.01)
CPC (source: EP KR)
H01L 24/29 (2013.01 - EP); H01L 24/81 (2013.01 - EP); H01L 24/83 (2013.01 - EP); H05K 3/32 (2013.01 - KR); H05K 3/321 (2013.01 - EP); H01L 2224/1319 (2013.01 - EP); H01L 2224/16225 (2013.01 - EP); H01L 2224/16227 (2013.01 - EP); H01L 2224/29101 (2013.01 - EP); H01L 2224/2919 (2013.01 - EP); H01L 2224/73204 (2013.01 - EP); H01L 2224/81801 (2013.01 - EP); H01L 2224/8319 (2013.01 - EP); H01L 2224/838 (2013.01 - EP); H01L 2924/01005 (2013.01 - EP); H01L 2924/01006 (2013.01 - EP); H01L 2924/01013 (2013.01 - EP); H01L 2924/01015 (2013.01 - EP); H01L 2924/01019 (2013.01 - EP); H01L 2924/01024 (2013.01 - EP); H01L 2924/01029 (2013.01 - EP); H01L 2924/01033 (2013.01 - EP); H01L 2924/01045 (2013.01 - EP); H01L 2924/01046 (2013.01 - EP); H01L 2924/01047 (2013.01 - EP); H01L 2924/01075 (2013.01 - EP); H01L 2924/01078 (2013.01 - EP); H01L 2924/01079 (2013.01 - EP); H01L 2924/01082 (2013.01 - EP); H01L 2924/01087 (2013.01 - EP); H01L 2924/014 (2013.01 - EP); H01L 2924/0665 (2013.01 - EP); H01L 2924/07802 (2013.01 - EP); H01L 2924/0781 (2013.01 - EP); H01L 2924/14 (2013.01 - EP); H01L 2924/19041 (2013.01 - EP); H01L 2924/19043 (2013.01 - EP); H01L 2924/19105 (2013.01 - EP); H01L 2924/30105 (2013.01 - EP); H01L 2924/30107 (2013.01 - EP); H01L 2924/3011 (2013.01 - EP); H05K 3/244 (2013.01 - EP); H05K 2201/0129 (2013.01 - EP); H05K 2201/0133 (2013.01 - EP); H05K 2201/10636 (2013.01 - EP); H05K 2201/10674 (2013.01 - EP); H05K 2201/10977 (2013.01 - EP); H05K 2201/10984 (2013.01 - EP); Y02P 70/50 (2015.11 - EP)
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
WO 9956509 A1 19991104; WO 9956509 A9 20000316; CN 1298626 A 20010606; EP 1090535 A1 20010411; EP 1090535 A4 20030924; JP 2003527736 A 20030916; KR 20010088292 A 20010926
DOCDB simple family (application)
US 9908787 W 19990422; CN 99805435 A 19990422; EP 99921432 A 19990422; JP 2000546558 A 19990422; KR 20007011636 A 20001020