Global Patent Index - EP 1090844 A1

EP 1090844 A1 2001-04-11 - Pouring spout array and process for forming same

Title (en)

Pouring spout array and process for forming same

Title (de)

Gruppe von Giessstüllen sowie Verfahren zur ihrer Herstellung

Title (fr)

Ensemble de becs verseurs et son procédé de fabrication

Publication

EP 1090844 A1 (EN)

Application

EP 00125515 A

Priority

  • EP 96926749 A
  • JP 20781995 A

Abstract (en)

A parts array (10) included a plurality of molded parts and a carrier to which each of the plurality of molded parts is attached so that the molded parts are arranged in a row on the carrier. The molded parts are attached to the carrier in such a way that they are separable from the carrier when the carrier is pulled away from the molded parts. The carrier is in the form of a pair of wires (31,33). <IMAGE>

IPC 1-7 (main, further and additional classification)

B65B 69/00

IPC 8 full level (invention and additional information)

B23P 19/00 (2006.01); B65B 69/00 (2006.01); B65D 5/02 (2006.01); B65D 5/72 (2006.01); B65D 5/74 (2006.01); B65D 73/00 (2006.01); B65D 73/02 (2006.01)

CPC (invention and additional information)

B65D 5/748 (2013.01); B65B 69/00 (2013.01); B65D 5/029 (2013.01); B65D 5/727 (2013.01); B65D 73/02 (2013.01)

Citation (search report)

Designated contracting state (EPC)

DE FR GB IT

EPO simple patent family

WO 9703884 A1 19970206; AU 6678596 A 19970218; AU 709787 B2 19990909; CA 2226764 A1 19970206; CN 1096389 C 20021218; CN 1135189 C 20040121; CN 1197434 A 19981028; CN 1343608 A 20020410; DE 69624145 D1 20021107; DE 69624145 T2 20030703; DE 69631915 D1 20040422; DE 69631915 T2 20050203; EP 0885143 A1 19981223; EP 0885143 A4 20000119; EP 0885143 B1 20021002; EP 1090844 A1 20010411; EP 1090844 B1 20040317; JP 3493564 B2 20040203; JP H0929555 A 19970204; KR 100425807 B1 20040630; TW 346439 B 19981201

INPADOC legal status


2009-08-31 [PG25 FR] LAPSED IN A CONTRACTING STATE ANNOUNCED VIA POSTGRANT INFORM. FROM NAT. OFFICE TO EPO

- Ref Country Code: FR

- Free text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

- Effective date: 20080731

2009-08-31 [PG25 IT] LAPSED IN A CONTRACTING STATE ANNOUNCED VIA POSTGRANT INFORM. FROM NAT. OFFICE TO EPO

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- Free text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

- Effective date: 20080719

2009-06-30 [PG25 GB] LAPSED IN A CONTRACTING STATE ANNOUNCED VIA POSTGRANT INFORM. FROM NAT. OFFICE TO EPO

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- Free text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

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2009-05-01 [REG FR ST] NOTIFICATION OF LAPSE

- Effective date: 20090331

2009-04-30 [PG25 DE] LAPSED IN A CONTRACTING STATE ANNOUNCED VIA POSTGRANT INFORM. FROM NAT. OFFICE TO EPO

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- Effective date: 20090203

2009-03-25 [GBPC] GB: EUROPEAN PATENT CEASED THROUGH NON-PAYMENT OF RENEWAL FEE

- Effective date: 20080719

2008-04-30 [PGFP FR] POSTGRANT: ANNUAL FEES PAID TO NATIONAL OFFICE

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- Payment date: 20070717

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2007-08-31 [PGFP DE] POSTGRANT: ANNUAL FEES PAID TO NATIONAL OFFICE

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2005-03-09 [26N] NO OPPOSITION FILED

- Effective date: 20041220

2004-11-19 [ET] FR: TRANSLATION FILED

2004-04-22 [REF] CORRESPONDS TO:

- Document: DE 69631915 P 20040422

2004-03-17 [AC] DIVISIONAL APPLICATION (ART. 76) OF:

- Document: EP 0885143 P

2004-03-17 [AK] DESIGNATED CONTRACTING STATES:

- Kind Code of Ref Document: B1

- Designated State(s): DE FR GB IT

2004-03-17 [REG GB FG4D] EUROPEAN PATENT GRANTED

2002-05-22 [17Q] FIRST EXAMINATION REPORT

- Effective date: 20020408

2002-01-02 [AKX] PAYMENT OF DESIGNATION FEES

- Free text: DE FR GB IT

2001-05-30 [RIN1] INVENTOR (CORRECTION)

- Inventor name: MOCK, ELMAR

2001-05-30 [RIN1] INVENTOR (CORRECTION)

- Inventor name: MORIYAMA, YASUYUKI

2001-04-11 [17P] REQUEST FOR EXAMINATION FILED

- Effective date: 20001121

2001-04-11 [AC] DIVISIONAL APPLICATION (ART. 76) OF:

- Document: EP 885143

2001-04-11 [AK] DESIGNATED CONTRACTING STATES:

- Kind Code of Ref Document: A1

- Designated State(s): DE FR GB IT