EP 1091831 A1 20010418 - IMPROVED POLISHING PAD WITH REDUCED MOISTURE ABSORPTION
Title (en)
IMPROVED POLISHING PAD WITH REDUCED MOISTURE ABSORPTION
Title (de)
VERBESSERTES POLIERKISSEN MIT REDUZIERTER FEUCHTIGKEITSABSORPTION
Title (fr)
TAMPON A POLIR AMELIORE AVEC UNE MOINDRE ABSORPTION D'HUMIDITE
Publication
Application
Priority
- GB 9901515 W 19990601
- US 8774298 P 19980602
Abstract (en)
[origin: WO9962673A1] A polishing pad or belt or other device with increased resistance to moisture absorption for improved planarizing effectiveness and consistency. The relatively moisture resistant polishing pad contains additives to improve wetting of the pad surface for good slurry distribution.
IPC 1-7
IPC 8 full level
B24B 37/24 (2012.01); B24D 3/26 (2006.01); B24D 3/34 (2006.01); B24D 11/00 (2006.01); H01L 21/304 (2006.01)
CPC (source: EP KR)
B24B 37/24 (2013.01 - EP); B24D 3/26 (2013.01 - EP); B24D 3/34 (2013.01 - EP); B24D 11/00 (2013.01 - KR); B24D 11/001 (2013.01 - EP)
Citation (search report)
See references of WO 9962673A1
Designated contracting state (EPC)
DE FR GB IE IT
DOCDB simple family (publication)
WO 9962673 A1 19991209; AU 4272499 A 19991220; EP 1091831 A1 20010418; JP 2002516764 A 20020611; KR 100563172 B1 20060327; KR 20010071381 A 20010728; TW 449528 B 20010811
DOCDB simple family (application)
GB 9901515 W 19990601; AU 4272499 A 19990601; EP 99955238 A 19990601; JP 2000551920 A 19990601; KR 20007013658 A 20001202; TW 88109099 A 19990602