EP 1092144 A1 20010418 - METHOD AND DEVICE FOR MANIPULATING PARTICLES IN MICROSYSTEMS
Title (en)
METHOD AND DEVICE FOR MANIPULATING PARTICLES IN MICROSYSTEMS
Title (de)
VERFAHREN UND VORRICHTUNG ZUR MANIPULATION VON PARTIKELN IN MIKROSYSTEMEN
Title (fr)
PROCEDE ET DISPOSITIF DE MANIPULATION DE PARTICULES DANS UN MICROSYSTEME
Publication
Application
Priority
- DE 19828919 A 19980629
- DE 19853658 A 19981120
- EP 9904468 W 19990628
Abstract (en)
[origin: US6465225B1] For manipulation of particles in a fluidic microsystem (15) in which the particles are moved in a predetermined reference direction in a suspension liquid, the microsystem (15) is closed off at least at its end (17a, 17b) pointing to the reference direction. The particles move under the influence of centrifugal forces and/or gravitational forces in the suspension liquid which is stationary in relation to the microsystem (15), with the centrifugal forces and/or gravitational forces essentially extending parallel to the reference direction. Furthermore, the particles in the microsystem (15) are exposed to deflection forces whose direction differs from that of the reference direction. (FIG. 1).
IPC 1-7
IPC 8 full level
B81C 99/00 (2010.01); B01L 3/00 (2006.01); B03C 1/00 (2006.01); B03C 1/30 (2006.01); B03C 5/00 (2006.01); B03C 5/02 (2006.01); B04B 5/02 (2006.01); C12M 1/00 (2006.01)
CPC (source: EP US)
B01L 3/50273 (2013.01 - EP US); B01L 3/502761 (2013.01 - EP US); B03C 5/026 (2013.01 - EP US); B01L 2200/0647 (2013.01 - EP US); B01L 2200/0652 (2013.01 - EP US); B01L 2300/0825 (2013.01 - EP US); B01L 2400/0409 (2013.01 - EP US); B01L 2400/0415 (2013.01 - EP US); B01L 2400/0424 (2013.01 - EP US); B01L 2400/0457 (2013.01 - EP US); Y10S 977/904 (2013.01 - EP US)
Citation (search report)
See references of WO 0000816A1
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
US 6465225 B1 20021015; EP 1092144 A1 20010418; JP 2002519183 A 20020702; WO 0000816 A1 20000106
DOCDB simple family (application)
US 72021901 A 20010222; EP 9904468 W 19990628; EP 99931204 A 19990628; JP 2000557138 A 19990628