EP 1093503 B1 20021002 - FINE PITCH ANISOTROPIC CONDUCTIVE ADHESIVE
Title (en)
FINE PITCH ANISOTROPIC CONDUCTIVE ADHESIVE
Title (de)
ANISOTROP LEITENDER KLEBSTOFF FÜR FEINEN KONTAKTABSTAND
Title (fr)
ADHESIF CONDUCTEUR ANISOTROPE COMPRENANT DES PARTICULES DISPOSEES SELON UN ESPACEMENT SERRE
Publication
Application
Priority
- US 9900460 W 19990108
- US 10815898 A 19980630
Abstract (en)
[origin: WO0000563A1] Disclosed is an anisotropic conductive adhesive (10) having an adhesive layer (12) and conductive particles (16) individually adhered to the adhesive layer, the conductive particles being arranged in an ordered array. The size of the conductive particles is at least somewhat smaller than the thickness of the adhesive layer. Also disclosed is an anisotropic conductive adhesive having an adhesive layer, conductive particles individually adhered to the adhesive layer, and a release liner (28) having an ordered array of dimples (24). The conductive particles reside in a single layer in the dimples. The anisotropic conductive adhesive is made by placing the conductive particles in an ordered array of dimples on a low adhesion surface. An adhesive layer is then laminated on top such that the conductive particles individually adhere to the adhesive layer. The anisotropic conductive adhesive may be used to electrically connect fine pitch electrodes on opposing circuit layers.
IPC 1-7
IPC 8 full level
C09J 7/00 (2006.01); C09J 9/02 (2006.01); H05K 3/32 (2006.01)
CPC (source: EP KR US)
C09J 5/06 (2013.01 - KR); C09J 9/02 (2013.01 - EP KR US); H05K 3/323 (2013.01 - EP KR US); C09J 2203/326 (2013.01 - KR); H05K 2201/09945 (2013.01 - EP US); H05K 2201/10234 (2013.01 - EP US); H05K 2203/0113 (2013.01 - EP US); H05K 2203/0338 (2013.01 - EP US); Y10T 156/109 (2015.01 - EP US); Y10T 156/1093 (2015.01 - EP US); Y10T 428/14 (2015.01 - EP US); Y10T 428/24372 (2015.01 - EP US); Y10T 428/24413 (2015.01 - EP US); Y10T 428/24669 (2015.01 - EP US); Y10T 428/24678 (2015.01 - EP US)
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
WO 0000563 A1 20000106; AU 2454199 A 20000117; CN 1307625 A 20010808; DE 69903305 D1 20021107; EP 1093503 A1 20010425; EP 1093503 B1 20021002; JP 2002519473 A 20020702; KR 20010053298 A 20010625; US 2001008169 A1 20010719
DOCDB simple family (application)
US 9900460 W 19990108; AU 2454199 A 19990108; CN 99807810 A 19990108; DE 69903305 T 19990108; EP 99904058 A 19990108; JP 2000557318 A 19990108; KR 20007015023 A 20001229; US 10815898 A 19980630