Global Patent Index - EP 1093850 B1

EP 1093850 B1 20060823 - Packed column and polymerizable compound treating method using the same

Title (en)

Packed column and polymerizable compound treating method using the same

Title (de)

Gepackte Säule und Verfahren zum Behandeln einer polymerisierbaren Verbindung unter Verwendung derselben

Title (fr)

Colonne garnie et procédé pour traiter un composé polymerisable

Publication

EP 1093850 B1 20060823 (EN)

Application

EP 00122639 A 20001017

Priority

JP 29785699 A 19991020

Abstract (en)

[origin: EP1093850A2] Provided are a packed column arranged so as to be capable of effectively preventing polymerization of a polymerizable compound such as a (meth)acrylic acid in treating the compound, and a method for treating a polymerizable compound using the packed column. The packed column, which is provided with a packing support plate and is filled with a packing on the packing support plate, is arranged so as to include a packing layer (B) having a greater percentage of voids than that of a packing layer (A), between the packing support plate and the packing layer (A). <IMAGE>

IPC 8 full level

B01D 3/14 (2006.01); B01D 3/16 (2006.01); B01D 3/32 (2006.01); B01J 10/00 (2006.01); B01J 19/30 (2006.01); B01J 19/32 (2006.01); C07C 51/44 (2006.01); C07C 57/07 (2006.01); C07C 67/54 (2006.01); C07C 69/54 (2006.01)

CPC (source: EP US)

B01D 3/324 (2013.01 - EP US); B01D 3/326 (2013.01 - EP US); B01J 19/305 (2013.01 - EP US); B01J 19/325 (2013.01 - EP US); B01J 2219/185 (2013.01 - EP US); B01J 2219/3221 (2013.01 - EP US); B01J 2219/32213 (2013.01 - EP US); B01J 2219/32272 (2013.01 - EP US); B01J 2219/32275 (2013.01 - EP US); B01J 2219/3325 (2013.01 - EP US)

Designated contracting state (EPC)

BE DE

DOCDB simple family (publication)

EP 1093850 A2 20010425; EP 1093850 A3 20011031; EP 1093850 B1 20060823; DE 60030225 D1 20061005; DE 60030225 T2 20070809; JP 2001113101 A 20010424; JP 4392085 B2 20091224; US 6891061 B1 20050510

DOCDB simple family (application)

EP 00122639 A 20001017; DE 60030225 T 20001017; JP 29785699 A 19991020; US 68816900 A 20001016