Global Patent Index - EP 1093937 A1

EP 1093937 A1 20010425 - Process for hot stamping and multi-layer structure for this process

Title (en)

Process for hot stamping and multi-layer structure for this process

Title (de)

Heissprägeverfahren und Laminat für die Anwendung dieses Verfahrens

Title (fr)

Procédé de marquage à chaud et structure multicouche pour la mise en oeuvre d'un tel procédé

Publication

EP 1093937 A1 20010425 (FR)

Application

EP 00402913 A 20001020

Priority

FR 9913228 A 19991022

Abstract (en)

Multi-layer cladding, incorporates a layer of heat setting varnish which is activated by UV rays to give a clean protective varnish cover in a single-stage operation. The decorative cladding, bonded by heat, has a multi-layer structure (10), with a layer of heat setting varnish a carrier layer (11) and a decorative layer (15). The varnish layer (14) is between the carrier (11) and decorative (15) layers. The structure is applied to the article surface with pressure and heat on the carrier layer (11), so that the decorative layer is against the covered surface to be transferred to it under the varnish layer. The carrier layer (11) is peeled off, and the varnish is set by radiation. The varnish is used with ultra violet (UV) rays as a heat setting UV varnish or a heat setting cation UV varnish. The varnish has a low mol. wt. preferably 800-2000 The varnish contains a solvent before it is mounted to the carrier, and it also contains one or more colors or pigments. The varnish contains photo-initiators at a rate of 0.3-3.0 mass% and preferably about 0.5 mass%. The decorative layer (15) is coated with a fusible adhesive (16). The varnish layer (14) is exposed to UV rays to bring it to its maximum temperature at the time of pressure application, and the heat applied to the carrier layer at a preferably reduced temp. of ≤ 30% of the max. temperature. The decorative layer is of metal, applied to the varnish layer by vacuum deposition when it is not exposed again to rays. Or it is an ink layer printed on the varnish layer.

Abstract (fr)

L'invention est relative au procédé de marquage à chaud permettant de réaliser un décor sur un article (A), caractérisé par le fait qu'il comprend les étapes consistant à : fournir une structure multicouche (10) comportant une couche de vernis durcissable sous l'effet d'un rayonnement, une couche de support (11) et une couche de décor (15), la couche de vernis (14) se situant entre la couche de support (11) et la couche de décor (15), amener la structure multicouche (10) au contact de l'article, appliquer pression et chaleur sur la couche de support (11) aux emplacements où l'on souhaite transférer la couche de décor (15) sur l'article, la couche de vernis étant agencée de manière à être transférée localement sur l'article (A) conjointement à la couche de décor (15), retirer la couche de support (11), provoquer le durcissement de la couche de vernis (14) transférée sur l'article en l'exposant audit rayonnement. <IMAGE>

IPC 1-7

B44C 1/17; B44C 1/165; B32B 27/20; B32B 27/28

IPC 8 full level

B41M 5/00 (2006.01); B32B 33/00 (2006.01); B44C 1/04 (2006.01); B44C 1/14 (2006.01); B44C 1/17 (2006.01); B44C 3/02 (2006.01); B41M 5/52 (2006.01); B41M 7/00 (2006.01)

CPC (source: EP US)

B44C 1/04 (2013.01 - EP US); B44C 1/14 (2013.01 - EP US); B44C 1/1729 (2013.01 - EP US); B41M 5/5272 (2013.01 - EP US); B41M 7/0027 (2013.01 - EP US); B41M 7/0054 (2013.01 - EP US); Y10S 428/914 (2013.01 - EP US); Y10S 428/915 (2013.01 - EP US); Y10T 156/1066 (2015.01 - EP US); Y10T 428/24388 (2015.01 - EP US); Y10T 428/24843 (2015.01 - EP US); Y10T 428/2486 (2015.01 - EP US); Y10T 428/24876 (2015.01 - EP US); Y10T 428/24917 (2015.01 - EP US); Y10T 428/28 (2015.01 - EP US); Y10T 428/2804 (2015.01 - EP US); Y10T 428/2848 (2015.01 - EP US)

Citation (search report)

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

DOCDB simple family (publication)

EP 1093937 A1 20010425; CA 2324023 A1 20010422; CA 2324023 C 20080408; FR 2800011 A1 20010427; FR 2800011 B1 20011207; JP 2001191642 A 20010717; JP 2004090653 A 20040325; US 7410551 B1 20080812

DOCDB simple family (application)

EP 00402913 A 20001020; CA 2324023 A 20001019; FR 9913228 A 19991022; JP 2000322505 A 20001023; JP 2003342901 A 20031001; US 68896100 A 20001017