EP 1094556 A2 20010425 - Low profile high density sockets and related method of manufacturing
Title (en)
Low profile high density sockets and related method of manufacturing
Title (de)
Niedrigprofilierte Buchsen hoher Dichte und entsprechendes Herstellungsverfahren
Title (fr)
Douilles à profil mince et à haute densité et méthode de fabrication y relative
Publication
Application
Priority
US 42171699 A 19991020
Abstract (en)
The invention resides in an electrical connector (2) capable of being used in an array of contact element (12, 12', 12'') disposed between two parallel spaced apart plates defining a gap (70) into which the connector (2) is inserted. The connector (2) employs a plurality of spacer bars (14) on which are carried a plurality of contact rings which are spaced apart from one another by one or more spacer elements (16, 16'). The position of the contact elements (12, 12', 12'') can be readily varied from one spacer bar (14) to the other by the addition or elimination of one or more spacers to customize the contact array for adapting to the contact placement on the contact plates. Another embodiment of the invention may include using spacer rods made from an elastomeric material which can be stretched to allow the contact rings to be slid over a necked down portion of the rod (16). <IMAGE>
IPC 1-7
IPC 8 full level
H01R 11/01 (2006.01); H01R 12/70 (2011.01); H01R 13/24 (2006.01); H01R 43/00 (2006.01); H01R 12/52 (2011.01)
CPC (source: EP)
H01R 12/7082 (2013.01); H01R 13/2414 (2013.01); H01R 12/52 (2013.01)
Designated contracting state (EPC)
DE FR GB IT
DOCDB simple family (publication)
EP 1094556 A2 20010425; EP 1094556 A3 20011024; EP 1094556 B1 20030502; DE 60002412 D1 20030605; DE 60002412 T2 20040311; DE 60016982 D1 20050127; DE 60016982 T2 20051229; EP 1315244 A1 20030528; EP 1315244 B1 20041222; JP 2001155804 A 20010608
DOCDB simple family (application)
EP 00122236 A 20001017; DE 60002412 T 20001017; DE 60016982 T 20001017; EP 03001369 A 20001017; JP 2000321513 A 20001020