EP 1095404 A1 20010502 - CIRCUIT AND A METHOD FOR THE PRODUCTION THEREOF
Title (en)
CIRCUIT AND A METHOD FOR THE PRODUCTION THEREOF
Title (de)
SCHALTUNGSANORDNUNG MIT EINEM DRUCKKONTAKT UND VERFAHREN ZU DEREN HERSTELLUNG
Title (fr)
CIRCUIT ET SON PROCEDE DE PRODUCTION
Publication
Application
Priority
- DE 9901973 W 19990701
- DE 19830537 A 19980708
Abstract (en)
[origin: WO0003437A1] According to the invention, a pressure contact (D) is arranged on a conducting region of the circuit in order to reinforce the connections of the circuit. Said pressure contact contains metal, e.g. copper, comprises an essentially planar upper surface which is situated above a passivation layer (S), and has flanks which are, to a large extent, essentially vertical. The metal is electrodeposited using a mask (P) which does not cover an area of the conducting region that is to be contacted, thus resulting in the production of the pressure contact (D). The electrodeposition process is concluded as long as the upper surface of the pressure contact (D) is situated underneath an upper surface of the mask (P). A conducting layer (L) which, for example, contains copper can be deposited on the conducting region in order to permit the application of a current for the electrodeposition process and can be deposited as a crystallization base.
IPC 1-7
IPC 8 full level
H01L 21/288 (2006.01); H01L 21/3205 (2006.01); H01L 21/768 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01)
CPC (source: EP KR)
H01L 21/288 (2013.01 - EP); H01L 21/2885 (2013.01 - EP); H01L 21/76879 (2013.01 - EP); H01L 21/76885 (2013.01 - EP); H01L 23/051 (2013.01 - KR); H01L 24/72 (2013.01 - EP); H01L 2924/01005 (2013.01 - EP); H01L 2924/01006 (2013.01 - EP); H01L 2924/01013 (2013.01 - EP); H01L 2924/01015 (2013.01 - EP); H01L 2924/01019 (2013.01 - EP); H01L 2924/0102 (2013.01 - EP); H01L 2924/01023 (2013.01 - EP); H01L 2924/01029 (2013.01 - EP); H01L 2924/01032 (2013.01 - EP); H01L 2924/01039 (2013.01 - EP); H01L 2924/01042 (2013.01 - EP); H01L 2924/01044 (2013.01 - EP); H01L 2924/01046 (2013.01 - EP); H01L 2924/01047 (2013.01 - EP); H01L 2924/01058 (2013.01 - EP); H01L 2924/01061 (2013.01 - EP); H01L 2924/01068 (2013.01 - EP); H01L 2924/01073 (2013.01 - EP); H01L 2924/01079 (2013.01 - EP); H01L 2924/04953 (2013.01 - EP); H01L 2924/1301 (2013.01 - EP); H01L 2924/13055 (2013.01 - EP); H01L 2924/13091 (2013.01 - EP)
Citation (search report)
See references of WO 0003437A1
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
WO 0003437 A1 20000120; EP 1095404 A1 20010502; JP 2002520856 A 20020709; KR 20010089134 A 20010929
DOCDB simple family (application)
DE 9901973 W 19990701; EP 99945844 A 19990701; JP 2000559597 A 19990701; KR 20017000272 A 20010108