Global Patent Index - EP 1095515 A2

EP 1095515 A2 20010502 - DYNAMIC STRUCTURAL COUPLING MECHANISM FOR REDUCING OPTICAL DEGRADATION IN VIBRATING ENVIRONMENTS

Title (en)

DYNAMIC STRUCTURAL COUPLING MECHANISM FOR REDUCING OPTICAL DEGRADATION IN VIBRATING ENVIRONMENTS

Title (de)

DYNAMISCHER STRUKTURELLER KUPPLUNGSMECHANISMUS ZUR VERMINDERUNG DER OPTISCHEN DEGRADIERUNG IN SCHWINGENDEN UMGEBUNGEN

Title (fr)

MECANISME DE COUPLAGE DYNAMIQUE STRUCTUREL POUR LA REDUCTION DE LA DEGRADATION OPTIQUE DANS DES ENVIRONNEMENTS VIBRANTS

Publication

EP 1095515 A2 20010502 (EN)

Application

EP 00908332 A 20000120

Priority

  • US 0001489 W 20000120
  • US 24878399 A 19990212
  • US 44902399 A 19991124

Abstract (en)

[origin: WO0048232A2] Vibration damping apparatus for vibrating environment such as a light emission microscope and an integrated circuit test head includes a rigid member with remotely controlled clamping means attached to spaced portions of the member. The clamping means engage the microscope and the test head for reducing vibrations, and the clamping means can be readily deactivated for moving the microscope or the test head for alignment purposes. Advantageously, two or more rigid members including pneumatic cylinders can be positioned around the device under test while permitting the use of mechanical probes for engaging nodes of an integrated circuit for test purposes.

[origin: WO0048232A2] Vibration damping apparatus for vibrating environment such as a light emission microscope (60) and integrated circuit test head (56) includes a rigid member (40) with remotely controlled clamping means attached to spaced portions of the member. The clamping means engage the microscope and the test head for reducing vibrations, and the clamping means can be readily deactivated for moving the microscope or the test head for alignment purposes. Advantageously, two or more rigid members including pneumatic cylinders (52) can be positioned around the device under test while permitting the use of mechanical probes for engaging nodes of an integrated circuit for test purposes.

IPC 1-7

H04N 7/00

IPC 8 full level

F16F 15/02 (2006.01); F16F 15/023 (2006.01); F16F 15/03 (2006.01); G02B 21/24 (2006.01)

CPC (source: EP)

G02B 21/24 (2013.01)

Citation (search report)

See references of WO 0048232A2

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

DOCDB simple family (publication)

WO 0048232 A2 20000817; WO 0048232 A3 20010215; WO 0048232 A9 20011115; AU 2969900 A 20000829; EP 1095515 A2 20010502; JP 2002541500 A 20021203

DOCDB simple family (application)

US 0001489 W 20000120; AU 2969900 A 20000120; EP 00908332 A 20000120; JP 2000599063 A 20000120