Global Patent Index - EP 1096028 A3

EP 1096028 A3 20020206 - High-strength aluminum alloy for pressure casting and cast aluminum alloy comprising the same

Title (en)

High-strength aluminum alloy for pressure casting and cast aluminum alloy comprising the same

Title (de)

Hochfeste Aluminium-Legierung zum Druckgiessen und daraus gegossene Aluminium-Legierung

Title (fr)

Alliage d'aluminium à haute résistance mécanique pour moulage sous pression et alliage d'aluminium ainsi fondu

Publication

EP 1096028 A3 20020206 (EN)

Application

EP 00309071 A 20001016

Priority

JP 29957899 A 19991021

Abstract (en)

[origin: EP1096028A2] Disclosed is a high-strength cast aluminum alloy obtained by: casting a high-strength aluminum alloy containing 3.5-4.3 % of Cu, 5.0-7.5 % of Si, 0.10-0.25 % of Mg, not more than 0.2 % of Fe, not more than 0.0003 % of P, and the balance comprising Al and unavoidable impurities; and subjecting the alloy thus cast to a T6 treatment. This cast alloy has finer eutectic Si grains by virtue of such a very low P content, enjoys casting and economic merits that are competitive with existing alloys, and satisfies higher mechanical requirements as to tensile strength, elongation, 0.2% proof strength and impact value.

IPC 1-7

C22C 21/04

IPC 8 full level

C22C 21/02 (2006.01); C22C 21/04 (2006.01)

CPC (source: EP)

C22C 21/04 (2013.01)

Citation (search report)

  • [A] EP 0618303 A1 19941005 - HITACHI METALS LTD [JP]
  • [A] US 4786340 A 19881122 - OGAWA MASAHIRO [JP], et al
  • [Y] PATENT ABSTRACTS OF JAPAN vol. 1996, no. 12 26 December 1996 (1996-12-26)
  • [Y] PATENT ABSTRACTS OF JAPAN vol. 1999, no. 03 31 March 1999 (1999-03-31)
  • [Y] PATENT ABSTRACTS OF JAPAN vol. 1998, no. 11 30 September 1998 (1998-09-30)
  • [Y] PATENT ABSTRACTS OF JAPAN vol. 1996, no. 01 31 January 1996 (1996-01-31)
  • [A] PATENT ABSTRACTS OF JAPAN vol. 1998, no. 02 30 January 1998 (1998-01-30)
  • [A] PATENT ABSTRACTS OF JAPAN vol. 1998, no. 14 31 December 1998 (1998-12-31)
  • [A] PATENT ABSTRACTS OF JAPAN vol. 017, no. 274 (C - 1064) 27 May 1993 (1993-05-27)
  • [A] PATENT ABSTRACTS OF JAPAN vol. 018, no. 468 (C - 1244) 31 August 1994 (1994-08-31)

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

DOCDB simple family (publication)

EP 1096028 A2 20010502; EP 1096028 A3 20020206; EP 1347066 A2 20030924; EP 1371741 A2 20031217; JP 2001123239 A 20010508

DOCDB simple family (application)

EP 00309071 A 20001016; EP 03006408 A 20001016; EP 03006409 A 20001016; JP 29957899 A 19991021