Global Patent Index - EP 1099183 A1

EP 1099183 A1 20010516 - MATERIAL DELIVERY SYSTEM FOR MINIATURE STRUCTURE FABRICATION

Title (en)

MATERIAL DELIVERY SYSTEM FOR MINIATURE STRUCTURE FABRICATION

Title (de)

MATERIALAUSLIEFERUNGSSYSTEM FÜR MINIATURSTRUKTUR-FABRIKATION

Title (fr)

SYSTEME D'APPORT DE MATIERE POUR FABRICATION DE STRUCTURE MINIATURE

Publication

EP 1099183 A1 20010516 (EN)

Application

EP 00935827 A 20000524

Priority

  • US 0009819 W 20000524
  • US 13548799 P 19990524

Abstract (en)

[origin: WO0072224A1] A material delivery system (10) is provided for miniature structures fabrication which has a substrate (11), a material carrier (15) having a deposition layer (16), and a laser beam (12) directed towards the material carrier element (15). A control unit (18) is operatively coupled to the substrate (11), the material carrier element (15) and laser beam (12) for exposing respective areas of the deposition layer (16) to the laser beam (12) in a patterned manner so that the depositable material (16) of the deposition layer (16) is transferred to the substrate (11) surface for deposition on its surface. The system (10) operates in either an additive mode of operation, or a subtractive mode of operation so that a workpiece (11) does not have to be removed from the tool when change of modes of operation takes place.

IPC 1-7

G06F 19/00; C23C 14/04; C23C 14/28

IPC 8 full level

B23K 15/00 (2006.01); B23K 26/04 (2006.01); B23K 26/08 (2006.01); B23K 26/36 (2006.01); B23K 26/40 (2006.01); C23C 14/04 (2006.01)

CPC (source: EP)

B23K 15/0013 (2013.01); B23K 15/002 (2013.01); B23K 15/0086 (2013.01); B23K 26/04 (2013.01); B23K 26/08 (2013.01); B23K 26/083 (2013.01); B23K 26/40 (2013.01); C23C 14/048 (2013.01); B23K 2103/42 (2018.07); B23K 2103/50 (2018.07); B23K 2103/52 (2018.07)

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

DOCDB simple family (publication)

WO 0072224 A1 20001130; AU 5122800 A 20001212; EP 1099183 A1 20010516; EP 1099183 A4 20041215

DOCDB simple family (application)

US 0009819 W 20000524; AU 5122800 A 20000524; EP 00935827 A 20000524