EP 1099253 A1 20010516 - PBGA PACKAGE WITH INTEGRATED BALL GRID
Title (en)
PBGA PACKAGE WITH INTEGRATED BALL GRID
Title (de)
PBGA-GEHÄUSE MIT INTEGRIERTEM KUGELRASTERRAHMEN
Title (fr)
BOITIER PBGA A GRILLE DE BILLAGE INTEGREE
Publication
Application
Priority
- FR 0001201 W 20000504
- FR 9905930 A 19990510
Abstract (en)
[origin: WO0068991A1] The invention concerns an integrated circuit package (5) comprising a cavity (2) wherein the integrated circuit (5) is fixed, the active surface (10) of the integrated circuit (3) being electrically connected to the package at the connection level (Nc) of a ball array (13i) on the package providing a mechanical and electrical link between the integrated circuit (5) and a printed circuit card whereon the package is to be assembled. The invention is characterised in that it comprises a rigid and electrically neutral additional layer (14) directly mounted on the connection level (Nc) of the integrated circuit (5) and the balls (13i), and contains the balls (13i). The invention is useful in particular for connections of BGA and PBGA packages.
IPC 1-7
IPC 8 full level
H01L 23/12 (2006.01); H01L 23/24 (2006.01); H01L 23/498 (2006.01)
CPC (source: EP)
H01L 23/24 (2013.01); H01L 23/49816 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48472 (2013.01); H01L 2924/01012 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15165 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/1532 (2013.01)
Citation (search report)
See references of WO 0068991A1
Designated contracting state (EPC)
DE ES FR GB IT
DOCDB simple family (publication)
FR 2793606 A1 20001117; FR 2793606 B1 20030613; EP 1099253 A1 20010516; JP 2002544670 A 20021224; JP 3520049 B2 20040419; WO 0068991 A1 20001116
DOCDB simple family (application)
FR 9905930 A 19990510; EP 00925385 A 20000504; FR 0001201 W 20000504; JP 2000617492 A 20000504