Global Patent Index - EP 1099254 A1

EP 1099254 A1 2001-05-16 - INTEGRATED CIRCUIT MODULE WITH ONE SURFACE COMPRISING AN ELECTRICALLY INSULATED PERIPHERAL ZONE OF THE INTEGRATED CIRCUIT, AND MIXED CONNECTION CARD COMPRISING SUCH A MODULE

Title (en)

INTEGRATED CIRCUIT MODULE WITH ONE SURFACE COMPRISING AN ELECTRICALLY INSULATED PERIPHERAL ZONE OF THE INTEGRATED CIRCUIT, AND MIXED CONNECTION CARD COMPRISING SUCH A MODULE

Title (de)

INTEGRIERTES SCHALTUNGSMODUL MIT EINER SEITE, DIE EINE VON DER INTEGRIERTEN SCHALTUNG ELEKTRISCH ISOLIERTE RANDZONE UMFASST, UND GEMISCHTE ANSCHLUSSKARTE, DIE EIN SOLCHES MODUL UMFASST

Title (fr)

MODULE A CIRCUIT INTEGRE AYANT UNE FACE COMPORTANT UNE ZONE PERIPHERIQUE ISOLEE ELECTRIQUEMENT DU CIRCUIT INTEGRE, ET CARTE A CONNEXION MIXTE COMPORTANT UN TEL MODULE

Publication

EP 1099254 A1 (FR)

Application

EP 99957214 A

Priority

  • FR 9901437 W
  • FR 9807912 A

Abstract (en)

[origin: FR2780201A1] The module (1) comprises a support film (2) with first surface (2.1) carrying the integrated circuit and internal connection pads. A second surface (2.2) carries external connection pads (5). The internal and external connection pads are connected to the integrated circuit. The film support second surface includes a peripheral zone (8) electrically isolated from the integrated circuit, extending in the region of the internal connection pads. This zone comprises a metallic layer of the same thickness as the connection pads. The module forms a card, within which there is an aerial (11).

IPC 1-7 (main, further and additional classification)

H01L 23/498; G06K 19/077; H01L 23/538

IPC 8 full level (invention and additional information)

G06K 19/077 (2006.01); G06K 19/07 (2006.01); H01L 23/12 (2006.01); H01L 23/498 (2006.01); H05K 3/32 (2006.01)

CPC (invention and additional information)

H05K 3/321 (2013.01); H01L 23/49855 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H05K 2201/09472 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/10477 (2013.01); H05K 2201/10719 (2013.01); H05K 2201/10727 (2013.01)

Combination set (CPC)

H01L 2224/48091 + H01L 2924/00014

Citation (search report)

See references of WO 9967822A1

Designated contracting state (EPC)

BE DE ES FR GB IT NL

EPO simple patent family

FR 2780201 A1 19991224; FR 2780201 B1 20010921; AU 4268999 A 20000110; CN 1312957 A 20010912; EP 1099254 A1 20010516; JP 2002519849 A 20020702; WO 9967822 A1 19991229

INPADOC legal status


2003-07-02 [18D] APPLICATION DEEMED TO BE WITHDRAWN

- Effective date: 20030102

2001-05-16 [17P] REQUEST FOR EXAMINATION FILED

- Effective date: 20010109

2001-05-16 [AK] DESIGNATED CONTRACTING STATES:

- Kind Code of Ref Document: A1

- Designated State(s): BE DE ES FR GB IT NL