Global Patent Index - EP 1099255 A1

EP 1099255 A1 2001-05-16 - METHOD FOR PRODUCING AND SEPARATING SEMICONDUCTOR LIGHT-EMITTING DIODES

Title (en)

METHOD FOR PRODUCING AND SEPARATING SEMICONDUCTOR LIGHT-EMITTING DIODES

Title (de)

VERFAHREN ZUR HERSTELLUNG UND VEREINZELUNG VON HALBLEITER-LICHTEMISSIONSDIODEN

Title (fr)

PROCEDE DE PRODUCTION ET DE SEPARATION DE DIODES ELECTROLUMINESCENTES A SEMI-CONDUCTEUR MICROSCOPIQUES

Publication

EP 1099255 A1 (DE)

Application

EP 99938154 A

Priority

  • DE 9901693 W
  • DE 19828970 A

Abstract (en)

[origin: DE19828970A1] The invention relates to a method for producing and separating microscopic semiconductor light-emitting diodes, comprising the following steps: a) producing a semiconductor light-emitting device (100) comprising a pn-junction (2-4) and metallization layers (6, 7); b) applying an etching mask (9-11) with a predetermined structure to one side of the semiconductor device (100), the masked areas corresponding to the arrangement and shape of the diodes (30) being formed; c) applying a support (8, 12) to the other side of the semiconductor device (100); d) vertically etching the semiconductor material into the openings of the etching mask (9-11) as far as the support (8, 12), hereby producing a diode arrangement containing a plurality of diodes (30) beneath the masked area; e) removing the etching mask (9-11); f) providing a holding device (20) containing recesses (22) whose arrangement and shape correspond to those of the diodes (30) and which are suitable for receiving diodes (30); g) locking the diode arrangement into the holding device (20); and h) removing the support (8, 12). The inventive method can be used for producing an LED display device with a high image point density.

IPC 1-7 (main, further and additional classification)

H01L 27/15; H01L 21/78; H01L 33/00

IPC 8 full level (invention and additional information)

H01L 21/78 (2006.01); H01L 25/075 (2006.01); H01L 27/15 (2006.01); H01L 33/00 (2010.01)

CPC (invention and additional information)

H01L 33/0062 (2013.01); H01L 21/78 (2013.01); H01L 25/0753 (2013.01); H01L 27/156 (2013.01); H01L 2924/0002 (2013.01)

Combination set (CPC)

H01L 2924/0002 + H01L 2924/00

Citation (search report)

See references of WO 0001014A1

Designated contracting state (EPC)

DE FR GB IT

EPO simple patent family

DE 19828970 A1 20000105; DE 19828970 C2 20000518; EP 1099255 A1 20010516; US 2001041410 A1 20011115; US 6475819 B2 20021105; WO 0001014 A1 20000106

INPADOC legal status


2008-08-27 [18W] APPLICATION WITHDRAWN

- Effective date: 20080716

2008-05-14 [17Q] FIRST EXAMINATION REPORT

- Effective date: 20080410

2001-05-16 [17P] REQUEST FOR EXAMINATION FILED

- Effective date: 20001110

2001-05-16 [AK] DESIGNATED CONTRACTING STATES:

- Kind Code of Ref Document: A1

- Designated State(s): DE FR GB IT