EP 1100131 A1 20010516 - CHIP LIGHT-EMITTING DEVICE
Title (en)
CHIP LIGHT-EMITTING DEVICE
Title (de)
CHIP LICHTEMITTIERENDE VORRICHTUNG
Title (fr)
DISPOSITIF A MICROCIRCUIT PHOTO-EMISSIF
Publication
Application
Priority
- JP 0001704 W 20000321
- JP 7550899 A 19990319
Abstract (en)
The notch 17 is formed at one end of the board (12) and the two notches (18a and 18b) are formed at both sides of the other end. The first and second electrode patterns (13 and 14) covering, which cover the notches formed at both ends, are formed on the board surface, the light emitting diode (LED) chip (11) is connected to the first electrode pattern (13) and the electrode (11a) of the LED chip (11) and the surface electrode (14a) of the second electrode pattern (14) are bonded to each other with the metal wire (15). The LED chip (10) and the metal wire (15) are embedded with the translucent resin mold 16. Wire bonding on the surface electrode (14a) of the second electrode pattern (14) with the other end (15b) of the metal wire is made on the board 12 located between the two notches (18a and 18b). As a result, wire bonding can be made stably. Moreover, the polarity of the LED chip can be checked easily based on the appearance. Furthermore, handling jprocess can be performed smoothly. <IMAGE>
IPC 1-7
IPC 8 full level
H01L 33/00 (2006.01); H01L 33/56 (2010.01); H01L 33/62 (2010.01)
CPC (source: EP US)
H01L 33/486 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48227 (2013.01 - EP US)
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
EP 1100131 A1 20010516; EP 1100131 A4 20070314; JP 2000269552 A 20000929; JP 3795248 B2 20060712; US 6777719 B1 20040817; WO 0057491 A1 20000928
DOCDB simple family (application)
EP 00909760 A 20000321; JP 0001704 W 20000321; JP 7550899 A 19990319; US 67452201 A 20010102