EP 1100644 A1 20010523 - METHOD FOR BRAZING BY SOLDER REFLOW ELECTRONIC COMPONENTS AND BRAZING DEVICE THEREFOR
Title (en)
METHOD FOR BRAZING BY SOLDER REFLOW ELECTRONIC COMPONENTS AND BRAZING DEVICE THEREFOR
Title (de)
VERFAHREN UND VORRICHTUNG ZUM AUFSCHMELZLÖTEN VON ELEKTRONISCHEN BAUGRUPPEN
Title (fr)
PROCEDE DE BRASAGE PAR REFUSION DE COMPOSANTS ELECTRONIQUES ET DISPOSITIF DE BRASAGE POUR LA MISE EN OEUVRE D'UN TEL PROCEDE
Publication
Application
Priority
- FR 9901657 W 19990708
- FR 9809773 A 19980730
Abstract (en)
[origin: FR2781706A1] The invention concerns a method for brazing by solder reflow electronic components (22) on a support, for example a printed circuit wafer (20) which consists in: arranging a solder alloy on the support (20) in sites for connecting the components (22); placing the components on the connection sites and brazing the components (22) properly speaking by a thermal treatment of the support, by contacting it, at a pressure close to atmospheric pressure, with a treating atmosphere comprising excited or unstable species substantially free from electrically charged species, the atmosphere being obtained by passing an initial treating gas in an electrical discharge, and the thermal treatment of the support being obtained by using the species thus heated by the action of the discharge.
IPC 1-7
IPC 8 full level
B23K 1/012 (2006.01); B23K 1/00 (2006.01); B23K 3/06 (2006.01); B23K 31/02 (2006.01); H05K 3/34 (2006.01)
CPC (source: EP KR)
B23K 1/012 (2013.01 - EP KR); H05K 3/3494 (2013.01 - EP); H05K 2203/087 (2013.01 - EP); H05K 2203/095 (2013.01 - EP); H05K 2203/1157 (2013.01 - EP)
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
WO 0006333 A1 20000210; AU 4625399 A 20000221; BR 9912560 A 20010502; CA 2338157 A1 20000210; CN 1307508 A 20010808; EP 1100644 A1 20010523; FR 2781706 A1 20000204; FR 2781706 B1 20000825; HU P0104961 A2 20020529; JP 2002521207 A 20020716; KR 20010053616 A 20010625; TW 416881 B 20010101
DOCDB simple family (application)
FR 9901657 W 19990708; AU 4625399 A 19990708; BR 9912560 A 19990708; CA 2338157 A 19990708; CN 99808004 A 19990708; EP 99929437 A 19990708; FR 9809773 A 19980730; HU P0104961 A 19990708; JP 2000562170 A 19990708; KR 20017001258 A 20010130; TW 88112437 A 19990722