Global Patent Index - EP 1101393 A1

EP 1101393 A1 2001-05-23 - METHOD FOR BRAZING BY SOLDER REFLOW ELECTRONIC COMPONENTS USING PRE-DEPOSITS OF SOLDER ALLOY AND BRAZING DEVICE THEREFOR

Title (en)

METHOD FOR BRAZING BY SOLDER REFLOW ELECTRONIC COMPONENTS USING PRE-DEPOSITS OF SOLDER ALLOY AND BRAZING DEVICE THEREFOR

Title (de)

REFLOW-LÖTVERFAHREN ELEKTRONISCHER BAUTEILE UNTER VERWENDUNG VORHER AUFGEBRACHTER LÖTLEGIERUNGSDEPOTS UND LÖTVORRICHTUNG ZUR DURCHFÜHRUNG EINES SOLCHEN VERFAHRENS

Title (fr)

PROCEDE DE BRASAGE PAR REFUSION DE COMPOSANTS ELECTRONIQUES UTILISANT DES PRE-DEPOTS D'ALLIAGE DE BRASURE ET DISPOSITIF DE BRASAGE POUR LA MISE EN OEUVRE D'UN TEL PROCEDE

Publication

EP 1101393 A1 (FR)

Application

EP 99929438 A

Priority

  • FR 9901658 W
  • FR 9809774 A

Abstract (en)

[origin: FR2781974A1] The invention concerns a method for brazing by solder reflow electronic components (22) on a support (20), which consists in: providing a solder alloy which has been subjected to a pre-deposit on the support sites for connecting the components and/or which has been subjected to a pre-deposit on sites/terminations of the components properly speaking; depositing curable glue on the support (20) bonding sites; and carrying out a dry process fluxing of the support by contacting said support with a fluxing atmosphere comprising excited or unstable species substantially free from electrically charged species.

IPC 1-7 (main, further and additional classification)

H05K 3/34

IPC 8 full level (invention and additional information)

B23K 1/00 (2006.01); B23K 1/008 (2006.01); B23K 1/20 (2006.01); H05K 3/34 (2006.01)

CPC (invention and additional information)

B23K 1/203 (2013.01); H05K 3/3489 (2013.01); B23K 2101/40 (2018.08)

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

DOCDB simple family

FR 2781974 A1 20000204; FR 2781974 B1 20000825; AU 4625499 A 20000221; BR 9912555 A 20010502; CA 2338181 A1 20000210; CN 1308838 A 20010815; EP 1101393 A1 20010523; HU 0104913 A2 20020529; JP 2002521851 A 20020716; TW 434073 B 20010516; WO 0007418 A1 20000210