Global Patent Index - EP 1101601 B1

EP 1101601 B1 20050126 - Corrugated board manufacturing system

Title (en)

Corrugated board manufacturing system

Title (de)

Anlage zur Herstellung einer Wellpappebahn

Title (fr)

Système pour la fabrication de carton ondulé

Publication

EP 1101601 B1 20050126 (DE)

Application

EP 00124858 A 20001115

Priority

DE 19955916 A 19991120

Abstract (en)

[origin: EP1101601A1] Laser sensors (10,11) move in the direction (9) across that (5) of the board being processed and measure the distances between them and the board surfaces to check the depth of grooves (6) the edges (25,26) and longitudinal slit (8).

IPC 1-7

B31F 1/28

IPC 8 full level

B31F 1/28 (2006.01)

CPC (source: EP)

B31F 1/2831 (2013.01)

Citation (examination)

US 5581353 A 19961203 - TAYLOR BRUCE F [US]

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

DOCDB simple family (publication)

EP 1101601 A1 20010523; EP 1101601 B1 20050126; AT E287791 T1 20050215; DE 19955916 A1 20010523; DE 50009341 D1 20050303; ES 2235740 T3 20050716

DOCDB simple family (application)

EP 00124858 A 20001115; AT 00124858 T 20001115; DE 19955916 A 19991120; DE 50009341 T 20001115; ES 00124858 T 20001115