Global Patent Index - EP 1103831 A3

EP 1103831 A3 20040204 - Flip-chip mounted opto-electronic circuit

Title (en)

Flip-chip mounted opto-electronic circuit

Title (de)

Optoelektronischer Schaltkreis mit Flip-chip-Montage

Title (fr)

Circuit opto-électronique à puce inversée

Publication

EP 1103831 A3 20040204 (EN)

Application

EP 00122783 A 20001019

Priority

US 43085199 A 19991101

Abstract (en)

[origin: EP1103831A2] An application-specific rf optoelectronic integrated circuit (10) having a generic chip (12) and a defining substrate (14) in communication with at least one generic chip (12). The generic chip (12) contains passive building block components (18,20,22,24,26) that are independent from each other and being connected by paths external to the generic chip member (12). The external connection paths are defined on the substrate (14) having passive components and providing optical and electrical interconnection. It is possible to use the same design of the generic chip (12) for several applications merely by altering the interconnect paths on a defining substrate (14). The optical interconnection is made by optical fibers positioned in V-grooves. The generic chip is flip-chip mounted using solder bumps. <IMAGE>

IPC 1-7

G02B 6/42; H01L 25/16

IPC 8 full level

G02B 6/42 (2006.01); H01L 21/82 (2006.01); H01L 27/14 (2006.01); H01L 27/144 (2006.01); H01L 27/15 (2006.01)

CPC (source: EP US)

G02B 6/4232 (2013.01 - EP US); H01L 27/1446 (2013.01 - EP US); G02B 6/423 (2013.01 - EP US); G02B 6/4246 (2013.01 - EP US)

Citation (search report)

  • [DX] US 5611008 A 19970311 - YAP DANIEL [US]
  • [A] EP 0903600 A1 19990324 - NEC CORP [JP]
  • [A] EP 0818822 A2 19980114 - NOKIA MOBILE PHONES LTD [FI]
  • [X] OHYAMA T ET AL: "ASSEMBLY AND ELECTRICAL WIRING TECHNOLOGIES ON PLANAR LIGHTWAVE CIRCUIT (PLC) PLATFORM PROVIDING HYBRID INTEGRATION OF OPTOELECTRONIC DEVICES AND INTEGRATED CIRCUITS (ICS)", IEICE TRANSACTIONS ON ELECTRONICS, INSTITUTE OF ELECTRONICS INFORMATION AND COMM. ENG. TOKYO, JP, vol. E82-C, no. 2, February 1999 (1999-02-01), pages 370 - 377, XP000893497, ISSN: 0916-8524
  • [A] MORIO KOBAYASHI ET AL: "HYBRID OPTICAL INTEGRATION TECHNOLOGY", ELECTRONICS & COMMUNICATIONS IN JAPAN, PART II - ELECTRONICS, SCRIPTA TECHNICA. NEW YORK, US, vol. 77, no. 10, 1 October 1994 (1994-10-01), pages 67 - 81, XP000545765, ISSN: 8756-663X

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

DOCDB simple family (publication)

EP 1103831 A2 20010530; EP 1103831 A3 20040204; JP 2001189445 A 20010710; JP 3429270 B2 20030722; US 2001038100 A1 20011108; US 6285043 B1 20010904; US 6495382 B2 20021217

DOCDB simple family (application)

EP 00122783 A 20001019; JP 2000334515 A 20001101; US 43085199 A 19991101; US 86595901 A 20010525