Title (en)

CONDUCTOR FRAME, PRINTED CIRCUIT BOARD WITH A CONDUCTOR FRAME AND A METHOD FOR PRODUCING A CONDUCTOR FRAME

Title (de)

LEITERBAHNRAHMEN, PLATINE MIT LEITERBAHNRAHMEN UND VERFAHREN ZUR HERSTELLUNG EINES LEITERBAHNRAHMENS

Title (fr)

CADRE A PISTES CONDUCTRICES, CARTE EQUIPEE D'UN TEL CADRE ET PROCEDE POUR LA FABRICATION DE CE DERNIER

Publication

EP 1104584 A1 20010606 (DE)

Application

EP 99945911 A 19990705

Priority

• DE 9902072 W 19990705
• DE 19833930 A 19980728

Abstract (en)

[origin: WO0007242A1] The invention relates to a conductor frame (1) comprising at least one integrated electronic circuit (4, 5), whereby the integrated electronic circuit (4, 5) is situated in the area of a main surface of the conductor frame (1). The inventive conductor frame (1) also comprises at least one signal line (9), whereby at least one electrically insulating plate (2, 2', 3, 3') and one electrically conductive earthed plate (14, 14') are arranged at least in sections between the integrated electronic circuit (4, 5) and the signal line (9). The invention also relates to a method for producing the inventive conductor frame (1).

IPC 1-7

H01L 23/538; H01L 23/50; H01L 23/498; H01L 25/065; H01L 23/367

IPC 8 full level

H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01L 23/50 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2006.01)

CPC (source: EP US)

H01L 23/3677 (2013.01 - EP US); H01L 23/49861 (2013.01 - EP US); H01L 23/50 (2013.01 - EP US); H01L 23/5383 (2013.01 - EP US); H01L 25/0657 (2013.01 - EP US); H01L 2225/06527 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US)

Citation (search report)

See references of WO 0007242A1

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

DOCDB simple family (publication)

WO 0007242 A1 20000210; EP 1104584 A1 20010606; US 2001019172 A1 20010906; US 6798045 B2 20040928

DOCDB simple family (application)

DE 9902072 W 19990705; EP 99945911 A 19990705; US 77191201 A 20010129