EP 1109179 A1 20010620 - Inductor structure on a semiconductor substrate
Title (en)
Inductor structure on a semiconductor substrate
Title (de)
Struktur einer Drosselspule auf einem Halbleitersubstrat
Title (fr)
Structure d'inductance sur substrat semiconducteur
Publication
Application
Priority
FR 9915840 A 19991215
Abstract (en)
[origin: JP2001223116A] PROBLEM TO BE SOLVED: To provide an inductance structure which is arranged on a semiconductor substrate, including an inductance and a conductive plane interposed between the semiconductor substrate and the inductance. SOLUTION: This inductance structure is equipped with the conductive plane including several separate conductive elements and several conductive tracks, wherein each conductive track connects at least the one conductive element to a contact point M of the conductive plane, and each of the conductive tracks is arranged so that the resultant of the electromotive forces induced therein by the inductances is substantially null.
Abstract (fr)
L'invention concerne une structure d'inductance agencée sur un substrat semiconducteur, comprenant une inductance (1) et un plan conducteur (10) disposé entre l'inductance et le substrat. Le plan conducteur (10) est formé de plusieurs éléments conducteurs disjoints (20), dont la connexion est réalisée par des pistes conductrices reliant au moins un élément conducteur (20) à un point de contact M du plan conducteur. Chacune des pistes conductrices est disposée de sorte que la résultante des forces électromotrices qui sont induites dans ladite piste conductrice par l'inductance soit sensiblement nulle. <IMAGE>
IPC 1-7
IPC 8 full level
H01F 17/00 (2006.01); H01F 27/00 (2006.01); H01F 27/36 (2006.01); H01P 3/08 (2006.01); H01P 9/02 (2006.01)
CPC (source: EP US)
H01F 17/0006 (2013.01 - EP US); H01F 27/36 (2013.01 - EP US); H01F 27/363 (2020.08 - EP US)
Citation (search report)
- [X] WO 9850956 A1 19981112 - UNIV LELAND STANFORD JUNIOR [US]
- [DA] EP 0780853 A1 19970625 - HEWLETT PACKARD CO [US]
Designated contracting state (EPC)
DE FR GB IT
DOCDB simple family (publication)
EP 1109179 A1 20010620; FR 2802700 A1 20010622; FR 2802700 B1 20020719; JP 2001223116 A 20010817; US 2001015473 A1 20010823; US 6462396 B2 20021008
DOCDB simple family (application)
EP 00410155 A 20001215; FR 9915840 A 19991215; JP 2000377431 A 20001212; US 73761900 A 20001214