EP 1110243 A1 20010627 - INTEGRATED COMPONENT, COMPOSITE BODY CONSISTING OF AN INTEGRATED COMPONENT AND A CONDUCTIVE STRUCTURE, CHIP CARD AND METHOD FOR PRODUCING THE INTEGRATED COMPONENT
Title (en)
INTEGRATED COMPONENT, COMPOSITE BODY CONSISTING OF AN INTEGRATED COMPONENT AND A CONDUCTIVE STRUCTURE, CHIP CARD AND METHOD FOR PRODUCING THE INTEGRATED COMPONENT
Title (de)
INTEGRIERTES BAUELEMENT, VERBUNDKÖRPER AUS EINEM INTEGRIERTEN BAUELEMENT UND EINER LEITERSTRUKTUR, CHIP-KARTE UND VERFAHREN ZUR HERSTELLUNG DES INTEGRIERTEN BAUELEMENTES
Title (fr)
ELEMENT INTEGRE, CORPS COMPOSITE CONSTITUE D'UN ELEMENT INTEGRE ET D'UNE STRUCTURE CONDUCTRICE, CARTE A PUCE ET PROCEDE DE PRODUCTION DE L'ELEMENT INTEGRE
Publication
Application
Priority
- DE 9902190 W 19990714
- DE 19833929 A 19980728
Abstract (en)
[origin: WO0007239A1] The invention relates to an integrated component (35) with at least one contact element (20) for connecting the component (35) to a fixing means (90). According to the invention, the component (35) is embodied in such a way that the contact element (20) is disposed in an edge area of the integrated component (35) and the contact element (20) has at least one contact surface (22) which is inclined in relation to a main surface of the component (35). The invention also relates to a method for the production of said component.
IPC 1-7
IPC 8 full level
H01L 23/485 (2006.01); H01L 23/498 (2006.01); H05K 3/34 (2006.01); H01L 29/06 (2006.01)
CPC (source: EP US)
H01L 23/49805 (2013.01 - EP US); H01L 23/49861 (2013.01 - EP US); H01L 24/02 (2013.01 - US); H01L 24/05 (2013.01 - EP); H05K 3/3442 (2013.01 - EP US); H01L 29/0657 (2013.01 - EP US); H01L 2924/01004 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01013 (2013.01 - EP US); H01L 2924/01019 (2013.01 - EP US); H01L 2924/01032 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01039 (2013.01 - EP US); H01L 2924/01047 (2013.01 - EP US); H01L 2924/01068 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/01087 (2013.01 - EP US); H01L 2924/12042 (2013.01 - EP US); H01L 2924/14 (2013.01 - EP US); H01L 2924/19042 (2013.01 - EP US); H05K 2201/09154 (2013.01 - EP US); H05K 2201/0919 (2013.01 - EP US); Y02P 70/50 (2015.11 - EP US)
Citation (search report)
See references of WO 0007239A1
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
WO 0007239 A1 20000210; EP 1110243 A1 20010627; US 2001021543 A1 20010913; US 6400006 B2 20020604
DOCDB simple family (application)
DE 9902190 W 19990714; EP 99947214 A 19990714; US 77167501 A 20010129