EP 1111629 A3 20020918 - Inductive component with flexible wiring board winding for high frequency low power switching network sections
Title (en)
Inductive component with flexible wiring board winding for high frequency low power switching network sections
Title (de)
Induktives Bauelement mit Wicklung aus flexibler Leiterplatte für hochfrequente Schaltnetzteile kleiner Leistung
Title (fr)
Composant inductif avec enroulement en panneau à circuit flexible pour alimentation à découpage haute fréquence de faible puissance
Publication
Application
Priority
DE 19961536 A 19991220
Abstract (en)
[origin: EP1111629A2] The component has a magnet core (10) and at least one winding (3) on a flexible circuit board (2) enclosing the core at least in sections. The circuit board is wound around the magnet core on a coil body (4). The circuit board is of strip form with inclined conducting tracks (3) and transverse contact lugs (5) with soldering eyes (6) for connecting the conducting tracks to coil body contact pins (7).
IPC 1-7
IPC 8 full level
H01F 27/28 (2006.01); H01F 5/00 (2006.01); H01F 5/04 (2006.01)
CPC (source: EP)
H01F 27/2804 (2013.01); H01F 5/003 (2013.01); H01F 5/04 (2013.01)
Citation (search report)
- [XY] US 5570074 A 19961029 - STEIGERWALD ROBERT L [US], et al
- [X] DE 1819904 U 19601020 - SCHALTBAU GMBH [DE]
- [X] DE 3732382 A1 19890406 - LUTZ FERDINAND DR [DE]
- [X] US 4755783 A 19880705 - FLEISCHER CATHY [US], et al
- [Y] DE 2714966 A1 19781012 - LICENTIA GMBH
- [Y] DE 2741608 A1 19790329 - SIEMENS AG
- [AD] US 5134770 A 19920804 - YERMAN ALEXANDER J [US], et al
- [X] PATENT ABSTRACTS OF JAPAN vol. 007, no. 267 (E - 213) 29 November 1983 (1983-11-29)
- [X] PATENT ABSTRACTS OF JAPAN vol. 1997, no. 06 30 June 1997 (1997-06-30)
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
EP 1111629 A2 20010627; EP 1111629 A3 20020918; DE 19961536 A1 20010712
DOCDB simple family (application)
EP 00127513 A 20001215; DE 19961536 A 19991220