EP 1113464 A2 20010704 - Microgapping process for magnetic cores
Title (en)
Microgapping process for magnetic cores
Title (de)
Verfahren zum Erzeugen eines Mikroluftspalts für Magnetkerne
Title (fr)
Procédé de formation d'un micro-entrefer pour noyaux magnétiques
Publication
Application
Priority
US 47257299 A 19991227
Abstract (en)
A magnetic device is assembled by first applying an adhesive to the end surface of a leg of one core portion, slipping a bobbin onto one of the legs (preferably a different leg) of the core portion, and mating the two core portions together. Then while observing the inductance of the coil, the two core portions are ground toward each other, gradually narrowing the adhesive-induced gap between the mating surfaces, until the desired inductance is achieved. The adhesive is then cured. Preferably the adhesive includes particulate matter to help resist the narrowing of the gap during the grinding process. Alternatively, the particulate matter can be applied to the mating surface without adhesive, and the resulting assembly can be clamped together. <IMAGE>
IPC 1-7
IPC 8 full level
H01F 3/14 (2006.01); H01F 27/26 (2006.01); H01F 21/08 (2006.01)
CPC (source: EP)
H01F 3/14 (2013.01); H01F 27/263 (2013.01); H01F 21/08 (2013.01)
Designated contracting state (EPC)
DE ES FR GB IT
DOCDB simple family (publication)
DOCDB simple family (application)
EP 00127941 A 20001221