EP 1114453 A1 20010711 - DEVICE COMPRISING ELECTRONIC COMPONENTS IN MUTUALLY INSULATED REGIONS OF A SEMICONDUCTOR MATERIAL LAYER AND METHOD FOR MAKING SAME
Title (en)
DEVICE COMPRISING ELECTRONIC COMPONENTS IN MUTUALLY INSULATED REGIONS OF A SEMICONDUCTOR MATERIAL LAYER AND METHOD FOR MAKING SAME
Title (de)
BAUELEMENT MIT ELEKTRISCHEN KOMPONENTEN IN DURCH EINE HALBLEITENDE SCHICHT GEGENEINANDER ISOLIERTEN GEBIETEN UND DESSEN HERSTELLUNGSVERFAHREN
Title (fr)
DISPOSITIF COMPORTANT DES COMPOSANTS ELECTRONIQUES DANS DES REGIONS MUTUELLEMENT ISOLEES D'UNE COUCHE DE MATERIAU SEMI-CONDUCTEUR ET PROCEDE DE FABRICATION D'UN TEL DISPOSITIF
Publication
Application
Priority
- FR 9902032 W 19990824
- FR 9810686 A 19980825
Abstract (en)
[origin: FR2782842A1] The invention concerns a method for making a device comprising electronic components (20a, 20b) in regions (32a, 32b) of a semiconductor material layer (12), said regions being mutually insulated. The method is characterised in that it comprises the following steps: a) forming electronic components (30) of the regions of a semiconductor material layer (12) formed by an electrically insulating layer (14); b) forming trenches passing right through the semiconductor material layer (12) so as to separate the regions (32a, 32b); c) filling up the trenches (30) with a fluid filling material; and d) hardening said filling material. The invention is useful for making integrated circuits comprising power components.
IPC 1-7
IPC 8 full level
H01L 21/762 (2006.01)
CPC (source: EP)
H01L 21/76224 (2013.01); H01L 21/7624 (2013.01); H01L 21/76264 (2013.01); H01L 21/76286 (2013.01)
Citation (search report)
See references of WO 0011711A1
Designated contracting state (EPC)
DE GB IT
DOCDB simple family (publication)
FR 2782842 A1 20000303; FR 2782842 B1 20030905; EP 1114453 A1 20010711; WO 0011711 A1 20000302
DOCDB simple family (application)
FR 9810686 A 19980825; EP 99939493 A 19990824; FR 9902032 W 19990824