EP 1115790 A1 20010718 - POLYESTER-POLYCARBONATE COMPOSITION WITH IMPROVED HOT-PLATE WELDABILITY
Title (en)
POLYESTER-POLYCARBONATE COMPOSITION WITH IMPROVED HOT-PLATE WELDABILITY
Title (de)
POLYESTER-POLYCARBONAT-MISCHUNG MIT VERBESSERTER VERSCHWEISSBARKEIT MITTELS EINER HEIZPLATTE
Title (fr)
COMPOSITION POLYESTER-POLYCARBONATE A SOUDABILITE PAR PLAQUE CHAUFFANTE AMELIOREE
Publication
Application
Priority
- JP 18943599 A 19990702
- US 0018294 W 20000630
Abstract (en)
[origin: WO0102487A1] The object of the present invention is to provide a resin composition with improved hot-plate weldability, in which no carbonized resin remains on the hot plate, and in which there is no drawing out of fine filaments of the resin. The present invention provides a resin composition which contains (A) a polyester resin at the rate of 98 to 1 wt %; (B) a polycarbonate resin at the rate of 1 to 98 wt %; (C) a core-shell copolymer at the rate of 0.5 to 18 wt %, and (D) a polytetrafluoroethylene with a number average molecular weight of 30,000 or greater at the rate of 0.01 to 4 wt % (with the total of (A) through (D) being 100 wt %).
IPC 1-7
IPC 8 full level
C08L 67/00 (2006.01); B29C 65/00 (2006.01); B29C 65/20 (2006.01); C08L 67/02 (2006.01); C08L 69/00 (2006.01); C08L 27/18 (2006.01); C08L 51/04 (2006.01)
CPC (source: EP KR)
B29C 65/20 (2013.01 - EP KR); B29C 66/71 (2013.01 - EP KR); C08L 27/18 (2013.01 - KR); C08L 51/04 (2013.01 - KR); C08L 67/02 (2013.01 - EP KR); C08L 69/00 (2013.01 - EP KR); B29K 2067/00 (2013.01 - EP); B29K 2069/00 (2013.01 - EP); B29L 2031/30 (2013.01 - EP); B29L 2031/747 (2013.01 - EP); C08J 2300/22 (2013.01 - KR); C08L 27/18 (2013.01 - EP); C08L 51/04 (2013.01 - EP); C08L 2207/53 (2013.01 - KR); C08L 2666/02 (2013.01 - KR)
Citation (search report)
See references of WO 0102487A1
Designated contracting state (EPC)
DE ES FR GB NL
DOCDB simple family (publication)
WO 0102487 A1 20010111; CN 1321180 A 20011107; EP 1115790 A1 20010718; JP 2001011293 A 20010116; JP 4486180 B2 20100623; KR 20010073015 A 20010731
DOCDB simple family (application)
US 0018294 W 20000630; CN 00801902 A 20000630; EP 00946995 A 20000630; JP 18943599 A 19990702; KR 20017002487 A 20010227