Global Patent Index - EP 1115801 A1

EP 1115801 A1 20010718 - BONDING AGENT HARDENABLE BY HIGH-ENERGY RADIATION AND/OR THERMALLY

Title (en)

BONDING AGENT HARDENABLE BY HIGH-ENERGY RADIATION AND/OR THERMALLY

Title (de)

MIT ENERGIEREICHER STRAHLUNG UND/ODER THERMISCH HÄRTBARE BINDEMITTEL

Title (fr)

LIANT DURCISSABLE PAR UN RAYONNEMENT HAUTE ENERGIE ET/OU PAR LA CHALEUR

Publication

EP 1115801 A1 20010718 (DE)

Application

EP 99942815 A 19990806

Priority

  • DE 19835917 A 19980807
  • EP 9905700 W 19990806

Abstract (en)

[origin: DE19835917A1] The invention relates to a bonding agent, preferably for a lacquer, which may be hardened by high-energy radiation and/or thermally and which contains a mixture of substances (a) having a monomer or polymer component including at least one vinyl ether, vinyl ester, (meth)acrylic and/or allyl group, and (b) containing saturated and/or unsaturated polymers different from component (a) as additional component, with the proviso that at least one of components (a), (b) contains structural units of general formulae (I) and/or (II) and the additional component (b) contains structural units of general formulae (I) and/or (II) at least when said component contains saturated polymers. The invention also relates to a method for the production of the bonding agent and a preparation containing the bonding agent according to the invention. Said preparation is obtained in the form of a pigmented or non-pigmented lacquer or a powder lacquer. The invention also relates to a working method for the production of lacquer coatings, wherein after application, said coatings are hardened thermally and/or by radiation with UV light or electron beams.

IPC 1-7

C09D 167/06; C09D 4/06

IPC 8 full level

C09D 4/00 (2006.01); C08G 18/68 (2006.01); C08G 63/47 (2006.01); C08G 63/553 (2006.01); C09D 4/06 (2006.01); C09D 5/00 (2006.01); C09D 5/03 (2006.01); C09D 5/46 (2006.01); C09D 163/10 (2006.01); C09D 167/07 (2006.01); C09D 175/16 (2006.01)

CPC (source: EP US)

C08G 18/683 (2013.01 - EP US); C08G 63/47 (2013.01 - EP US); C08G 63/553 (2013.01 - EP US); C09D 163/10 (2013.01 - EP US); C09D 167/07 (2013.01 - EP US); C09D 175/16 (2013.01 - EP US)

Citation (search report)

See references of WO 0008108A1

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

DOCDB simple family (publication)

DE 19835917 A1 20000210; EP 1115801 A1 20010718; JP 2002522588 A 20020723; US 6632481 B1 20031014; WO 0008108 A1 20000217; WO 0008108 A8 20000316

DOCDB simple family (application)

DE 19835917 A 19980807; EP 9905700 W 19990806; EP 99942815 A 19990806; JP 2000563735 A 19990806; US 76248601 A 20010207