EP 1116165 A2 20010718 - METHOD FOR PRODUCING METALLIC MICROSTRUCTURES AND USE OF THIS METHOD IN THE PRODUCTION OF SENSOR DEVICES FOR DETECTING FINGERPRINTS
Title (en)
METHOD FOR PRODUCING METALLIC MICROSTRUCTURES AND USE OF THIS METHOD IN THE PRODUCTION OF SENSOR DEVICES FOR DETECTING FINGERPRINTS
Title (de)
VERFAHREN ZUR HERSTELLUNG METALLISCHER FEINSTRUKTUREN UND ANWENDUNG DES VERFAHRENS BEI DER HERSTELLUNG VON SENSORANORDNUNGEN ZUR ERFASSUNG VON FINGERABDRÜCKEN
Title (fr)
PROCEDE POUR PRODUIRE DES STRUCTURES FINES METALLIQUES ET MISE EN OEUVRE DUDIT PROCEDE LORS DE LA PRODUCTION DE DISPOSITIFS DETECTEURS SERVANT A DETECTER DES EMPREINTES DIGITALES
Publication
Application
Priority
- DE 9902631 W 19990824
- DE 19839642 A 19980831
Abstract (en)
[origin: WO0013130A2] First strip conductors (5), a first insulating layer (6), fine structures with first electrodes (51), two strip conductors (7), second electrodes (71) and finally a second insulating layer (8) are deposited one after the other on a base layer (3) that is preferably flexible. The first electrodes (51) are connected to the assigned strip conductors (5) by means of throughplatings. Changes caused by the cuticular sulci of a finger pad in the stray capacitance between adjacent first and second electrodes are evaluated to detect fingerprints.
IPC 1-7
IPC 8 full level
G01B 7/28 (2006.01); A61B 5/117 (2016.01); A61B 5/1172 (2016.01); B81C 1/00 (2006.01); G01B 7/34 (2006.01); G06K 9/00 (2006.01); G06T 1/00 (2006.01)
CPC (source: EP US)
G06V 40/1306 (2022.01 - EP US)
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
WO 0013130 A2 20000309; WO 0013130 A3 20000608; AT E218727 T1 20020615; EP 1116165 A2 20010718; EP 1116166 A2 20010718; EP 1116166 B1 20020605; JP 2002523789 A 20020730; US 2001028253 A1 20011011; US 6481294 B2 20021119; WO 0013129 A2 20000309; WO 0013129 A3 20000622
DOCDB simple family (application)
DE 9902695 W 19990827; AT 99953626 T 19990827; DE 9902631 W 19990824; EP 99953565 A 19990824; EP 99953626 A 19990827; JP 2000568045 A 19990824; US 79621401 A 20010228