EP 1117747 A1 20010725 - ADHESIVE COMPOSITIONS AND THEIR PRECURSORS
Title (en)
ADHESIVE COMPOSITIONS AND THEIR PRECURSORS
Title (de)
KLEBSTOFFZUSAMMENSETZUNGEN UND DEREN VORPRODUKTE
Title (fr)
COMPOSITIONS ADHESIVES ET LEURS PRECURSEURS
Publication
Application
Priority
- JP 21250598 A 19980728
- US 9913486 W 19990615
Abstract (en)
[origin: WO0006661A1] An adhesive composition comprising a resin component containing a thermoplastic resin, an epoxy resin and a curing agent, characterized in that said thermoplastic resin contains a pressure sensitive adhesive polymer; and said resin component contains an inorganic colloid dispersed therein. A precursor for the adhesive composition is also disclosed.
IPC 1-7
IPC 8 full level
C09J 7/02 (2006.01); C09J 163/00 (2006.01); C09J 201/00 (2006.01); H05K 3/38 (2006.01)
CPC (source: EP KR)
C08L 33/04 (2013.01 - KR); C08L 63/00 (2013.01 - KR); C09J 9/00 (2013.01 - KR); C09J 11/04 (2013.01 - KR); C09J 11/08 (2013.01 - KR); C09J 163/00 (2013.01 - EP); C09J 171/00 (2013.01 - KR); C09J 201/00 (2013.01 - EP KR); H05K 3/386 (2013.01 - EP); C08L 2666/02 (2013.01 - EP); C08L 2666/14 (2013.01 - EP); H05K 2201/0129 (2013.01 - EP); H05K 2201/0355 (2013.01 - EP)
Citation (search report)
See references of WO 0006661A1
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
WO 0006661 A1 20000210; BR 9912488 A 20010417; CN 1156549 C 20040707; CN 1317039 A 20011010; EP 1117747 A1 20010725; JP 2000053934 A 20000222; KR 100609804 B1 20060809; KR 20010071044 A 20010728
DOCDB simple family (application)
US 9913486 W 19990615; BR 9912488 A 19990615; CN 99810521 A 19990615; EP 99933514 A 19990615; JP 21250598 A 19980728; KR 20017001177 A 20010127