EP 1117747 A1 20010725 - ADHESIVE COMPOSITIONS AND THEIR PRECURSORS

Title (en)

ADHESIVE COMPOSITIONS AND THEIR PRECURSORS

Title (de)

KLEBSTOFFZUSAMMENSETZUNGEN UND DEREN VORPRODUKTE

Title (fr)

COMPOSITIONS ADHESIVES ET LEURS PRECURSEURS

Publication

EP 1117747 A1 20010725 (EN)

Application

EP 99933514 A 19990615

Priority

JP 21250598 A 19980728
US 9913486 W 19990615

Abstract (en)

[origin: WO0006661A1] An adhesive composition comprising a resin component containing a thermoplastic resin, an epoxy resin and a curing agent, characterized in that said thermoplastic resin contains a pressure sensitive adhesive polymer; and said resin component contains an inorganic colloid dispersed therein. A precursor for the adhesive composition is also disclosed.

IPC 1-7

C09J 163/00; C09J 133/00; C08K 3/22

IPC 8 full level

C09J 7/02 (2006.01); C09J 163/00 (2006.01); C09J 201/00 (2006.01); H05K 3/38 (2006.01)

CPC (source: EP KR)

C08L 33/04 (2013.01 - KR); C08L 63/00 (2013.01 - KR); C09J 9/00 (2013.01 - KR); C09J 11/04 (2013.01 - KR); C09J 11/08 (2013.01 - KR); C09J 163/00 (2013.01 - EP); C09J 171/00 (2013.01 - KR); C09J 201/00 (2013.01 - EP KR); H05K 3/386 (2013.01 - EP); C08L 2666/02 (2013.01 - EP); C08L 2666/14 (2013.01 - EP); H05K 2201/0129 (2013.01 - EP); H05K 2201/0355 (2013.01 - EP)

C-Set (source: EP)

Citation (search report)

See references of WO 0006661A1

Designated contracting state (EPC)

DE FR GB

DOCDB simple family (publication)

WO 0006661 A1 20000210; BR 9912488 A 20010417; CN 1156549 C 20040707; CN 1317039 A 20011010; EP 1117747 A1 20010725; JP 2000053934 A 20000222; KR 100609804 B1 20060809; KR 20010071044 A 20010728

DOCDB simple family (application)

US 9913486 W 19990615; BR 9912488 A 19990615; CN 99810521 A 19990615; EP 99933514 A 19990615; JP 21250598 A 19980728; KR 20017001177 A 20010127