EP 1118120 A1 20010725 - PACKAGE FOR PROVIDING IMPROVED ELECTRICAL CONTACT AND METHODS FOR FORMING THE SAME
Title (en)
PACKAGE FOR PROVIDING IMPROVED ELECTRICAL CONTACT AND METHODS FOR FORMING THE SAME
Title (de)
PACKUNG ZUR HERSTELLUNG EINES VERBESSERTEN ELEKTRISCHEN KONTAKTES UND DIESBEZÜGLICHE VERFAHREN
Title (fr)
BOITIER POUR FORMER UN MEILLEUR CONTACT ELECTRIQUE ET PROCEDES DE REALISATION CORRESPONDANTS
Publication
Application
Priority
- US 9914800 W 19990629
- US 16378198 A 19980930
Abstract (en)
[origin: WO0019532A1] A package for connecting electrical components to a substrate is disclosed. The package includes conductive castellations around the perimeter of the package. The castellations are configured to electrically connect to the substrate, and to electrically connect to conductive features at an interior portion of the package. In turn, electrical components may be electrically connected to the castellations. The package may be used to form a module by electrically connecting the electrical components to the package and integrating the components by connecting various components or portions thereof to other components or portions thereof.
IPC 1-7
IPC 8 full level
H01L 23/498 (2006.01); H05K 3/34 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01); H05K 3/40 (2006.01)
CPC (source: EP)
H01L 23/49805 (2013.01); H05K 3/3442 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/09701 (2013.01); H05K 1/0268 (2013.01); H05K 1/141 (2013.01); H05K 3/403 (2013.01); H05K 2201/09181 (2013.01); H05K 2201/0919 (2013.01); Y02P 70/50 (2015.11)
C-Set (source: EP)
Citation (search report)
See references of WO 0019532A1
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
DOCDB simple family (application)
US 9914800 W 19990629; EP 99935373 A 19990629