Global Patent Index - EP 1119025 A3

EP 1119025 A3 20060517 - Wafer holder for semiconductor manufacturing apparatus

Title (en)

Wafer holder for semiconductor manufacturing apparatus

Title (de)

Waferhalter für eine Halbleiterherstellungsvorrichtung

Title (fr)

Support de plaquettes semiconductrices pour un appareil de fabrication de semiconducteurs

Publication

EP 1119025 A3 20060517 (EN)

Application

EP 01300423 A 20010118

Priority

JP 2000012225 A 20000120

Abstract (en)

[origin: EP1119025A2] A wafer holder includes a heater (1) and at least one pair of ceramic base members (4) with the heater (1) interposing therebetween. A backside structure (A) located on the backside relative to heater (1) has a heat insulating structure. The ceramic base member (4) in the backside structure (A) is formed of ceramic having a lower heat conductivity than that of the ceramic base member (4) in a holding surface side structure (B). Further, the ceramic base member (4) in the backside structure (A) has a heat conductivity of 100 W/mK or less and a joint layer (5) has a heat conductivity of 10 W/mK or less. In this way, the wafer holder can be provided capable of preventing heat from spreading toward the backside of the wafer holder.

IPC 8 full level

H01L 21/00 (2006.01); H01L 21/302 (2006.01); H01L 21/3065 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01)

CPC (source: EP KR US)

H01L 21/00 (2013.01 - KR); H01L 21/67103 (2013.01 - EP US)

Citation (search report)

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

DOCDB simple family (publication)

EP 1119025 A2 20010725; EP 1119025 A3 20060517; CA 2326093 A1 20010720; CA 2326093 C 20040629; JP 2001203257 A 20010727; KR 100411215 B1 20031218; KR 20010076386 A 20010811; TW 475235 B 20020201; US 6365879 B1 20020402

DOCDB simple family (application)

EP 01300423 A 20010118; CA 2326093 A 20001116; JP 2000012225 A 20000120; KR 20010003153 A 20010119; TW 90100925 A 20010116; US 70781000 A 20001107