EP 1120795 A1 20010801 - Laminated lightweight radiation shielding materials
Title (en)
Laminated lightweight radiation shielding materials
Title (de)
Mehrschicht-Leichtbau-Strahlenschutzstruktur
Title (fr)
Couverture de protection contre les radiations composée de couches stratifiées et de poids réduit
Publication
Application
Priority
US 48963500 A 20000124
Abstract (en)
Laminated materials or structures that provide radiation shielding for spacecraft components in an orbiting spacecraft against electron and proton radiation. The laminated materials or structures have three laminated layers. The first layer (11) is made of one or more materials having a low Z/A (atomic number/atomic weight) ratio that preferentially attenuates electron and proton radiation, although they may generate Bremsstrahlung radiation in the process. The second layer (12) is made of one or more materials with a high Z<2>/A (atomic number squared/atomic weight) ratio that preferentially attenuate Bremsstrahlung radiation, although the materials may generate photo-electrons in the process. The third layer (13) is made of one or more materials having a low Z/A (atomic number/atomic weight) ratio that attenuate photo-electrons emitted from the second layer, as well as electrons and protons that pass through the first and second layers. <IMAGE>
IPC 1-7
IPC 8 full level
CPC (source: EP)
G21F 1/106 (2013.01); G21F 1/125 (2013.01)
Citation (search report)
- [A] US 4923741 A 19900508 - KOSMO JOSEPH J [US], et al
- [DA] US 5324952 A 19940628 - CUMMINGS BRENT C [US]
- [DA] EP 0242295 A1 19871021 - AEROSPATIALE [FR]
- [DA] SPIETH B D ET AL: "Shielding electronics behind composite structures", 1998 IEEE NUCLEAR AND SPACE RADIATION EFFECTS CONFERENCE (NSREC'98), NEWPORT BEACH, CA, USA, 20-24 JULY 1998, vol. 45, no. 6, pt.1, IEEE Transactions on Nuclear Science, Dec. 1998, IEEE, USA, pages 2752 - 2757, XP002163551, ISSN: 0018-9499
Designated contracting state (EPC)
DE FR GB IT
DOCDB simple family (publication)
DOCDB simple family (application)
EP 01300625 A 20010124; JP 2000363979 A 20001130