Global Patent Index - EP 1121008 A4

EP 1121008 A4 20050202 - MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

Title (en)

MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

Title (de)

MEHRSCHICHTIGE LEITERPLATTE UND VERFAHREN ZU DEREN HERSTELLUNG

Title (fr)

CARTE IMPRIMEE MULTICOUCHES ET SON PROCEDE DE FABRICATION

Publication

EP 1121008 A4 20050202 (EN)

Application

EP 99933214 A 19990730

Priority

  • JP 9904142 W 19990730
  • JP 24938298 A 19980903
  • JP 28194098 A 19980916
  • JP 28194298 A 19980916
  • JP 30324798 A 19981009
  • JP 4351499 A 19990222
  • JP 4351599 A 19990222
  • JP 6024099 A 19990308
  • JP 11624699 A 19990423

Abstract (en)

[origin: EP1121008A1] An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 mu m) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved. <IMAGE>

IPC 1-7

H05K 3/46

IPC 8 full level

B23K 26/38 (2006.01); H05K 3/00 (2006.01); H05K 3/38 (2006.01); H05K 3/46 (2006.01); H05K 1/02 (2006.01); H05K 3/10 (2006.01); H05K 3/28 (2006.01); H05K 3/42 (2006.01)

CPC (source: EP KR US)

B23K 26/389 (2015.10 - EP US); H05K 3/0035 (2013.01 - EP US); H05K 3/0038 (2013.01 - EP US); H05K 3/383 (2013.01 - EP US); H05K 3/46 (2013.01 - KR); H05K 3/4602 (2013.01 - EP US); H05K 3/4623 (2013.01 - EP US); H05K 3/4652 (2013.01 - EP US); H01L 2224/16225 (2013.01 - EP US); H01L 2924/15174 (2013.01 - EP US); H01L 2924/15311 (2013.01 - EP US); H05K 1/0201 (2013.01 - EP US); H05K 3/0032 (2013.01 - EP US); H05K 3/0055 (2013.01 - EP US); H05K 3/0094 (2013.01 - EP US); H05K 3/108 (2013.01 - EP US); H05K 3/28 (2013.01 - EP US); H05K 3/381 (2013.01 - EP US); H05K 3/384 (2013.01 - EP US); H05K 3/427 (2013.01 - EP US); H05K 3/4661 (2013.01 - EP US); H05K 2201/0195 (2013.01 - EP US); H05K 2201/0352 (2013.01 - EP US); H05K 2201/0358 (2013.01 - EP US); H05K 2201/062 (2013.01 - EP US); H05K 2201/09536 (2013.01 - EP US); H05K 2201/0959 (2013.01 - EP US); H05K 2201/09827 (2013.01 - EP US); H05K 2201/09863 (2013.01 - EP US); H05K 2201/09881 (2013.01 - EP US); H05K 2203/0307 (2013.01 - EP US); H05K 2203/0353 (2013.01 - EP US); H05K 2203/0554 (2013.01 - EP US); H05K 2203/0773 (2013.01 - EP US); H05K 2203/107 (2013.01 - EP US); H05K 2203/121 (2013.01 - EP US); Y10T 29/49117 (2015.01 - EP US); Y10T 29/49124 (2015.01 - EP US); Y10T 29/49126 (2015.01 - EP US); Y10T 29/49128 (2015.01 - EP US); Y10T 29/4913 (2015.01 - EP US); Y10T 29/49155 (2015.01 - EP US); Y10T 29/49156 (2015.01 - EP US); Y10T 29/49165 (2015.01 - EP US)

Citation (search report)

  • [Y] GB 2307351 A 19970521 - MARCONI GEC LTD [GB]
  • [YA] US 4917758 A 19900417 - ISHIZUKA KOICHI [JP], et al
  • [Y] US 5055321 A 19911008 - ENOMOTO RYO [JP], et al
  • [AY] EP 0811480 A1 19971210 - IBIDEN CO LTD [JP]
  • [Y] EP 0855454 A1 19980729 - MEC CO LTD [JP]
  • [AY] EP 0844809 A2 19980527 - IBIDEN CO LTD [JP]
  • [XY] WO 9831204 A1 19980716 - IBIDEN CO LTD [JP], et al & EP 0966185 A1 19991222 - IBIDEN CO LTD [JP]
  • [AY] US 5446247 A 19950829 - CERGEL LUBOMIR [US], et al
  • [X] EP 0841840 A1 19980513 - HEWLETT PACKARD CO [US]
  • [Y] EP 0800336 A1 19971008 - IBIDEN CO LTD [JP]
  • [AYX] WO 9820533 A2 19980514 - GORE & ASS [US]
  • [AY] US 5733468 A 19980331 - CONWAY JR JOHN W [US]
  • [X] US 5352325 A 19941004 - KATO YOJI [JP]
  • [AX] US 5063280 A 19911105 - INAGAWA HIDEHO [JP], et al
  • [A] WO 9741713 A1 19971106 - ALLIED SIGNAL INC [US]
  • [PA] WO 9903316 A1 19990121 - IBIDEN CO LTD [JP], et al
  • [AY] PATENT ABSTRACTS OF JAPAN vol. 1998, no. 05 30 April 1998 (1998-04-30) & US 5879568 A 19990309 - URASAKI NAOYUKI [JP], et al
  • [YA] PATENT ABSTRACTS OF JAPAN vol. 1998, no. 05 30 April 1998 (1998-04-30)
  • [YAX] PATENT ABSTRACTS OF JAPAN vol. 1997, no. 11 28 November 1997 (1997-11-28) & US 5826330 A 19981027 - ISODA SATOSHI [JP], et al
  • [Y] PATENT ABSTRACTS OF JAPAN vol. 1998, no. 01 30 January 1998 (1998-01-30)
  • [Y] GRIGOR'YANTS A G ET AL: "SPECIAL FEATURES OF WELDING 12KH18N9T STEEL WITH CONTINUOUS RADIATION OF A CO2 LASER UNDER MULTIMODE AND SINGLE MODE GENERATIONCONDITIONS", WELDING INTERNATIONAL, WELDING INSTITUTE. ABINGTON, GB, vol. 4, no. 11, 1990, pages 880 - 882, XP000151121, ISSN: 0950-7116
  • [X] "MICROSTRUCTURED SOLDER MASK BY MEANS OF LASER ABLATION", IBM TECHNICAL DISCLOSURE BULLETIN, IBM CORP. NEW YORK, US, vol. 36, no. 11, 1 November 1993 (1993-11-01), pages 589 - 590, XP000424959, ISSN: 0018-8689
  • [A] PATENT ABSTRACTS OF JAPAN vol. 1997, no. 01 31 January 1997 (1997-01-31)
  • [Y] KESTENBAUM A ET AL: "LASER DRILLING OF MICROVIAS IN EPOXY-GLASS PRINTED CIRCUIT BOARDDS", IEEE TRANSACTIONS ON COMPONENTS,HYBRIDS,AND MANUFACTURING TECHNOLOGY, IEEE INC. NEW YORK, US, vol. 13, no. 4, 1 December 1990 (1990-12-01), pages 1055 - 1062, XP000176849, ISSN: 0148-6411
  • [A] "STRUCTURING OF LAMINATED CU-POLYIMIDE FILMS VIA LASER ABLATION", IBM TECHNICAL DISCLOSURE BULLETIN, IBM CORP. NEW YORK, US, vol. 37, no. 8, 1 August 1994 (1994-08-01), pages 481, XP000456496, ISSN: 0018-8689
  • See references of WO 0015015A1

Designated contracting state (EPC)

DE FI GB NL

DOCDB simple family (publication)

EP 1121008 A1 20010801; EP 1121008 A4 20050202; EP 1121008 B1 20080730; DE 69939221 D1 20080911; EP 1843649 A2 20071010; EP 1843649 A3 20071031; EP 1843650 A2 20071010; EP 1843650 A3 20071107; EP 1843650 B1 20120307; KR 100855528 B1 20080901; KR 100855529 B1 20080901; KR 100855530 B1 20080901; KR 20010088796 A 20010928; KR 20070086858 A 20070827; KR 20070086859 A 20070827; KR 20070086860 A 20070827; KR 20070086861 A 20070827; KR 20070086862 A 20070827; KR 20070086863 A 20070827; KR 20070086864 A 20070827; MY 123228 A 20060531; MY 139553 A 20091030; US 2001042637 A1 20011122; US 2004025333 A1 20040212; US 2008173473 A1 20080724; US 2008189943 A1 20080814; US 2012125680 A1 20120524; US 6591495 B2 20030715; US 7415761 B2 20080826; US 7832098 B2 20101116; US 8148643 B2 20120403; WO 0015015 A1 20000316

DOCDB simple family (application)

EP 99933214 A 19990730; DE 69939221 T 19990730; EP 07013523 A 19990730; EP 07013524 A 19990730; JP 9904142 W 19990730; KR 20017002801 A 20010302; KR 20077015079 A 20070629; KR 20077015080 A 20070629; KR 20077015081 A 20070629; KR 20077015082 A 20070629; KR 20077015083 A 20070629; KR 20077015085 A 20070629; KR 20077015087 A 20070629; MY PI0404181 A 19990902; MY PI9903796 A 19990902; US 201213357663 A 20120125; US 35646403 A 20030203; US 79791601 A 20010305; US 87548607 A 20071019; US 9858208 A 20080407