Global Patent Index - EP 1122030 A2

EP 1122030 A2 20010808 - Abrasive tool

Title (en)

Abrasive tool

Title (de)

Schleifwerkzeug

Title (fr)

Outil abrasif

Publication

EP 1122030 A2 20010808 (EN)

Application

EP 01101689 A 20010130

Priority

JP 2000029614 A 20000207

Abstract (en)

In the electrodeposited abrasive wheel 20 of the abrasive tool according to the present invention, plural mound parts 21, which are upheaved at the central domain of base metal 19 in almost columnar shape, are arranged mostly in the shape of lattice. <??>An abrasive grain layer 22 is formed on a base metal 19, and plural ultra abrasive grains 14 are adhered only to each mound parts 21 by electrodeposited metal phase 25, and referred as the small abrasive-grain-layer parts 24, respectively. <??>Ultra abrasive grains are laid out at corner R part 21a and top 21b of the mound parts 21 at the small abrasive-grain-layer parts 24. <??>Ultra abrasive grains at each small abrasive-grain-layer parts are set as 11-500 pieces, and the rate which ultra abrasive grains occupy to the whole area of abrasive grain layer accounted by plane projection is set as 20% - 80% of the range. <??>At the time of grinding, only ultra abrasive grains contact to grinding work piece, then high abutment pressure is maintained, and sharpness and the discharge performance of ground wastes are good. <IMAGE>

IPC 1-7

B24D 3/06; B24D 7/00; B24B 37/04; B24B 53/12; B24D 18/00

IPC 8 full level

B24B 53/12 (2006.01); B24D 3/00 (2006.01); B24D 3/06 (2006.01); B24D 7/06 (2006.01); B24D 18/00 (2006.01)

CPC (source: EP KR)

B24B 53/017 (2013.01 - EP); B24B 53/12 (2013.01 - EP); B24D 3/06 (2013.01 - EP KR); B24D 7/06 (2013.01 - EP); B24D 18/0018 (2013.01 - EP)

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

DOCDB simple family (publication)

EP 1122030 A2 20010808; EP 1122030 A3 20031210; EP 1122030 B1 20060628; AT E331591 T1 20060715; DE 60121070 D1 20060810; DE 60121070 T2 20070606; EP 1500469 A1 20050126; HK 1039296 A1 20020419; JP 2001219376 A 20010814; KR 100749385 B1 20070814; KR 20010078363 A 20010820

DOCDB simple family (application)

EP 01101689 A 20010130; AT 01101689 T 20010130; DE 60121070 T 20010130; EP 04024424 A 20010130; HK 02100678 A 20020129; JP 2000029614 A 20000207; KR 20010005927 A 20010207