Title (en)

Water-soluble copper, copper alloys and non-ferrous metals intermediate cold and hot rolling composition

Title (de)

Wasserlösliche Zusammensetzung für Kalt- und Warmwalzen von Kupfer, Kupferlegierungen und Nichteisen-Metalzwischenprodukten

Title (fr)

Composition soluble dans l'eau pour le laminage à froid et à chaud de cuivre, d'aliages de cuivre et de produits intermédiaires non-ferreux

Publication

EP 1123971 A1 20010816 (EN)

Application

EP 00400348 A 20000208

Priority

EP 00400348 A 20000208

Abstract (en)

The present invention relates to a water-soluble copper, copper alloys and non-ferrous metals intermediate cold and hot rolling composition comprising a base stock oil and, based on the total weight of the composition : from 1 to 80% by weight of a combination of a monoester of a fatty acid with a polyol and a tetraester of a fatty acid with pentaerythritol; the weight monoester : tetraester ratio of said combination ranging from 1:20 to 10:1; and from 0.02 to 2% by weight of an azole derivative. The invention also relates to an oil-in-water emulsion, an intermediate cold rolling process, a hot rolling process and the use of the oil-in-water emulsion in an intermediate cold or hot rolling process. <IMAGE>

IPC 1-7

C10M 173/00; C10M 169/04

IPC 8 full level

B21B 45/02 (2006.01); C10M 101/02 (2006.01); C10M 125/14 (2006.01); C10M 129/10 (2006.01); C10M 129/16 (2006.01); C10M 129/42 (2006.01); C10M 129/74 (2006.01); C10M 129/76 (2006.01); C10M 133/08 (2006.01); C10M 133/38 (2006.01); C10M 133/44 (2006.01); C10M 133/46 (2006.01); C10M 135/10 (2006.01); C10M 135/32 (2006.01); C10M 135/36 (2006.01); C10M 137/04 (2006.01); C10M 155/02 (2006.01); C10M 159/04 (2006.01); C10M 169/04 (2006.01); C10M 173/00 (2006.01); C10N 20/02 (2006.01); C10N 30/00 (2006.01); C10N 40/24 (2006.01)

CPC (source: EP US)

C10M 141/06 (2013.01 - EP US); C10M 141/12 (2013.01 - EP US); C10M 173/00 (2013.01 - EP US); C10M 2201/105 (2013.01 - EP US); C10M 2203/1065 (2013.01 - EP US); C10M 2207/026 (2013.01 - EP US); C10M 2207/126 (2013.01 - EP US); C10M 2207/283 (2013.01 - EP US); C10M 2207/289 (2013.01 - EP US); C10M 2209/104 (2013.01 - EP US); C10M 2215/042 (2013.01 - EP US); C10M 2215/223 (2013.01 - EP US); C10M 2223/04 (2013.01 - EP US); C10M 2229/02 (2013.01 - EP US); C10N 2030/02 (2013.01 - EP US); C10N 2030/12 (2013.01 - EP US); C10N 2030/24 (2020.05 - EP US); C10N 2040/24 (2013.01 - EP US)

Citation (search report)

• [A] GB 1521081 A 19780809 - EXXON RESEARCH ENGINEERING CO
• [A] US 3923671 A 19751202 - KNEPP JAMES E
• [A] US 4767554 A 19880830 - MALITO JOHN T [US], et al
• [A] PATENT ABSTRACTS OF JAPAN vol. 1996, no. 11 29 November 1996 (1996-11-29)
• [A] DATABASE WPI Section Ch Week 197412, Derwent World Patents Index; Class H07, AN 1974-22038V, XP002141302
• [A] DATABASE WPI Section Ch Week 198804, Derwent World Patents Index; Class E13, AN 1988-025259, XP002141832

Designated contracting state (EPC)

FR

DOCDB simple family (publication)

EP 1123971 A1 20010816; AT E278753 T1 20041015; AU 2001233748 B2 20041223; AU 3374801 A 20010820; BR 0108159 A 20030121; CA 2397879 A1 20010816; CN 1395612 A 20030205; DE 60106208 D1 20041111; DE 60106208 T2 20060216; EP 1257624 A1 20021120; EP 1257624 B1 20041006; JP 2003522282 A 20030722; US 2006142167 A1 20060629; WO 0159046 A1 20010816

DOCDB simple family (application)

EP 00400348 A 20000208; AT 01905750 T 20010207; AU 2001233748 A 20010207; AU 3374801 A 20010207; BR 0108159 A 20010207; CA 2397879 A 20010207; CN 01803780 A 20010207; DE 60106208 T 20010207; EP 0101381 W 20010207; EP 01905750 A 20010207; JP 2001558186 A 20010207; US 18249302 A 20021115