EP 1126478 A1 20010822 - PTC DEVICE AND METHOD FOR PRODUCING THE SAME
Title (en)
PTC DEVICE AND METHOD FOR PRODUCING THE SAME
Title (de)
PTC-BAUTEIL UND HERSTELLUNGSVERFAHREN
Title (fr)
DISPOSITIF A COEFFICIENT DE TEMPERATURE POSITIF ET SON PROCEDE DE FABRICATION
Publication
Application
Priority
- JP 0004777 W 20000714
- JP 20261799 A 19990716
Abstract (en)
On the surface of formed composition material (12) in which a conductive powder filler is blended and kneaded with a crystalline polymer by 35 to 60 volume percent, conductive material (13) is pressure sealed and buried so that part of the conductive material is exposed, and plated electrodes (14A) and (14B) are formed by plating treatment on formed composition material (12) with partly exposed conductive material (13). And at least one out of TiC, WC, W2C, ZrC, VC, NbC, TaC, and Mo2C is used as conductive powder filler. The adhesion between the PTC composition material and the electrodes becomes good, and it becomes possible to reduce contact resistance value between the two. Further a PTC element with excellent stability to repeated turning on electricity can be obtained. <IMAGE>
IPC 1-7
IPC 8 full level
H01C 1/142 (2006.01); H01C 7/02 (2006.01); H01C 7/04 (2006.01); H01C 17/065 (2006.01); H05B 3/14 (2006.01)
CPC (source: EP KR)
H01C 1/142 (2013.01 - EP); H01C 7/02 (2013.01 - KR); H01C 7/027 (2013.01 - EP); H01C 7/049 (2013.01 - EP); H01C 17/0652 (2013.01 - EP); H05B 3/146 (2013.01 - EP)
Designated contracting state (EPC)
DE FR GB SE
DOCDB simple family (publication)
EP 1126478 A1 20010822; EP 1126478 A4 20020109; CA 2344532 A1 20010125; CN 1318201 A 20011017; JP 2001035640 A 20010209; KR 20010079845 A 20010822; NO 20011325 D0 20010315; NO 20011325 L 20010516; TW 472499 B 20020111; WO 0106521 A1 20010125
DOCDB simple family (application)
EP 00946362 A 20000714; CA 2344532 A 20000714; CN 00801438 A 20000714; JP 0004777 W 20000714; JP 20261799 A 19990716; KR 20017003431 A 20010316; NO 20011325 A 20010315; TW 89114201 A 20000715