EP 1127376 A1 20010829 - INTEGRATED CIRCUIT CHIP MADE SECURE AGAINST THE ACTION OF ELECTROMAGNETIC RADIATION
Title (en)
INTEGRATED CIRCUIT CHIP MADE SECURE AGAINST THE ACTION OF ELECTROMAGNETIC RADIATION
Title (de)
INTEGRIERTER SCHALTKREIS-CHIP, GESCHÜTZT GEGEN DIE BEHANDLUNG MIT ELEKTROMAGNETISCHER STRAHLUNG
Title (fr)
PUCE A CIRCUITS INTEGRES SECURISEE CONTRE L'ACTION DE RAYONNEMENTS ELECTROMAGNETIQUES
Publication
Application
Priority
- FR 9902428 W 19991008
- FR 9813029 A 19981016
Abstract (en)
[origin: FR2784768A1] An integrated circuit (5) may be protected from maloperation due to the incidence of infrared electromagnetic radiation by a doped layer, an irregular surface or a metallic screen. Where doping is used it comprises the addition of some 1019 atoms of Phosphorus or Boron per cm3 in a layer (14) located above the processor, memory units and contacts (8) of the integrated circuit
IPC 1-7
IPC 8 full level
B42D 15/10 (2006.01); G06K 19/073 (2006.01); G06K 19/077 (2006.01); H01L 21/822 (2006.01); H01L 23/552 (2006.01); H01L 27/04 (2006.01)
CPC (source: EP US)
G06K 19/073 (2013.01 - EP US); G06K 19/07372 (2013.01 - EP US); H01L 23/552 (2013.01 - EP US); H01L 24/48 (2013.01 - EP US); H01L 2224/05599 (2013.01 - EP US); H01L 2224/451 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48227 (2013.01 - EP US); H01L 2224/48465 (2013.01 - EP US); H01L 2224/85399 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01013 (2013.01 - EP US); H01L 2924/01019 (2013.01 - EP US); H01L 2924/01024 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01046 (2013.01 - EP US); H01L 2924/01051 (2013.01 - EP US); H01L 2924/0106 (2013.01 - EP US); H01L 2924/01061 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/01094 (2013.01 - EP US); H01L 2924/13091 (2013.01 - EP US); H01L 2924/14 (2013.01 - EP US); H01L 2924/181 (2013.01 - EP US)
Citation (search report)
See references of WO 0024058A1
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
FR 2784768 A1 20000421; CN 1217411 C 20050831; CN 1323448 A 20011121; EP 1127376 A1 20010829; JP 2002528896 A 20020903; JP 4694693 B2 20110608; US 8138566 B1 20120320; WO 0024058 A1 20000427
DOCDB simple family (application)
FR 9813029 A 19981016; CN 99812223 A 19991008; EP 99947524 A 19991008; FR 9902428 W 19991008; JP 2000577713 A 19991008; US 80768699 A 19991008