Global Patent Index - EP 1127385 A1

EP 1127385 A1 20010829 - METHOD FOR PRODUCING RADIO-FREQUENCY WAVE RECEIVERS BY INTERCONNECTING THREE DIMENSIONAL INTEGRATED CIRCUITS

Title (en)

METHOD FOR PRODUCING RADIO-FREQUENCY WAVE RECEIVERS BY INTERCONNECTING THREE DIMENSIONAL INTEGRATED CIRCUITS

Title (de)

VERFAHREN ZUR REALISIERUNG VON EMPFÄNGEN FÜR ELEKTROMAGNETISCHE WELLEN DURCH VERBINDEN VON INTEGRIERTEN SCHALTKREISEN IN DREI DIMENSIONEN

Title (fr)

PROCEDE DE REALISATION DE RECEPTEURS D'ONDES RADIOELECTRIQUES PAR INTERCONNEXION DE CIRCUITS INTEGRES EN TROIS DIMENSIONS

Publication

EP 1127385 A1 20010829 (FR)

Application

EP 99950839 A 19991026

Priority

  • FR 9902606 W 19991026
  • FR 9813814 A 19981103

Abstract (en)

[origin: FR2785452A1] The invention concerns a method which consists in stacking (3) semiconductor chips each containing at least an integrated circuit and comprising connecting pads for interconnecting the chips. The outer surface of the chips is metal-coated (4) to produce a ground plane for the receiver antenna. The ground plane (5) is covered with a dielectric material whereof the surface not shared with the ground plane is metal-coated then etched (6) to form the receiver antenna. The invention is applicable to receivers incorporated in ammunitions.

IPC 1-7

H01Q 21/00

IPC 8 full level

H01Q 21/00 (2006.01)

CPC (source: EP)

H01Q 21/0093 (2013.01)

Citation (search report)

See references of WO 0026992A1

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

DOCDB simple family (publication)

FR 2785452 A1 20000505; FR 2785452 B1 20030613; DE 69911047 D1 20031009; DE 69911047 T2 20040429; EP 1127385 A1 20010829; EP 1127385 B1 20030903; EP 1127385 B9 20040303; WO 0026992 A1 20000511

DOCDB simple family (application)

FR 9813814 A 19981103; DE 69911047 T 19991026; EP 99950839 A 19991026; FR 9902606 W 19991026