EP 1129479 A1 20010905 - SYSTEM FOR ASSEMBLING SUBSTRATES TO BONDING ZONES PROVIDED WITH CAVITIES
Title (en)
SYSTEM FOR ASSEMBLING SUBSTRATES TO BONDING ZONES PROVIDED WITH CAVITIES
Title (de)
MONTAGEMETHODE VON SUBSTRATEN MIT HALTEBEREICHEN MIT KAVITÄTEN
Title (fr)
SYSTEME D'ASSEMBLAGE DE SUBSTRATS A ZONES D'ACCROCHAGE POURVUES DE CAVITES
Publication
Application
Priority
- FR 9902626 W 19991028
- FR 9813583 A 19981029
Abstract (en)
[origin: FR2785449A1] The invention concerns a device comprising a first substrate (100) with at least a bonding zone (110a, 110b), capable of being assembled with a second substrate (200), the bonding zone (110a, 110b) having a surface made of material (104) capable of being wetted by a fusible material. The invention is characterised in that the bonding zone (110a, 110b) is provided with at least one cavity (20) for receiving the fusible material.
IPC 1-7
IPC 8 full level
B81B 7/00 (2006.01); B81C 1/00 (2006.01); H01L 21/50 (2006.01); H01L 23/10 (2006.01); H01L 23/552 (2006.01); H01L 23/66 (2006.01)
CPC (source: EP US)
B81B 7/0064 (2013.01 - EP US); B81C 1/00269 (2013.01 - EP US); H01L 21/50 (2013.01 - EP US); H01L 23/10 (2013.01 - EP US); H01L 23/552 (2013.01 - EP US); H01L 23/66 (2013.01 - EP US); B81C 2203/019 (2013.01 - EP US); H01L 2924/1617 (2013.01 - EP US); Y10T 428/12347 (2015.01 - EP US); Y10T 428/12396 (2015.01 - EP US); Y10T 428/12528 (2015.01 - EP US)
Citation (search report)
See references of WO 0026958A1
Designated contracting state (EPC)
DE GB IT
DOCDB simple family (publication)
FR 2785449 A1 20000505; FR 2785449 B1 20021129; EP 1129479 A1 20010905; US 6531232 B1 20030311; WO 0026958 A1 20000511
DOCDB simple family (application)
FR 9813583 A 19981029; EP 99950858 A 19991028; FR 9902626 W 19991028; US 80768801 A 20010416