Global Patent Index - EP 1130129 A1

EP 1130129 A1 20010905 - Source for thermal physical vapor deposition of organic electroluminescent layers

Title (en)

Source for thermal physical vapor deposition of organic electroluminescent layers

Title (de)

Quelle für thermische PVD-Beschichtung für organische elektrolumineszente Schichten

Title (fr)

Source pour depôt thermique physique en phase vapeur de couches organiques électroluminescentes

Publication

EP 1130129 A1 20010905 (EN)

Application

EP 01200573 A 20010219

Priority

US 51860000 A 20000303

Abstract (en)

A thermal physical vapor deposition electroluminescent source includes a housing (10) defining an enclosure having side walls (12,14) and a bottom wall (15), the enclosure receiving solid organic electroluminescent material (40) which can be vaporized, and the width of the housing having a dimension w<sub>h</sub>; and the housing has a conductive portion defining a vapor efflux aperture slit (22) having a width w<sub>s</sub> for permitting vaporized electroluminescent materials to pass through the slit onto a surface of a substrate. A conductive baffle member (30) has width b, the baffle member being centered on the slit and spaced from the side walls and spaced from the top plate by a distance m, the baffle member substantially providing a line-of-sight covering of the slit preventing direct access of vaporized electroluminescent materials to the slit, and preventing particulate electroluminescent materials from passing through the slit; and a straight-line projection from an edge of the slit to an edge of the baffle member onto a side wall defining a position on the side wall such that such position is spaced from the top plate by a dimension L. The ratio of the dimensions w<sub>h</sub> to w<sub>s</sub> is in a range of from 1.5 to 6.0; the ratio of L to w<sub>s</sub> is in a range of from 2 to 6; and the ratio of m to L is in a range of from 0.15 to 0.40. Heat is applied to different parts of the housing to cause vapor deposition.

IPC 1-7

C23C 14/24

IPC 8 full level

C23C 14/12 (2006.01); C23C 14/24 (2006.01); H01L 51/50 (2006.01); H05B 33/10 (2006.01); H01L 51/00 (2006.01)

CPC (source: EP US)

C23C 14/243 (2013.01 - EP US); H10K 71/164 (2023.02 - EP US)

Citation (applicant)

Citation (search report)

Designated contracting state (EPC)

DE FR GB

DOCDB simple family (publication)

US 6237529 B1 20010529; DE 60144355 D1 20110519; EP 1130129 A1 20010905; EP 1130129 B1 20110406; JP 2001291589 A 20011019; JP 4520059 B2 20100804

DOCDB simple family (application)

US 51860000 A 20000303; DE 60144355 T 20010219; EP 01200573 A 20010219; JP 2001058355 A 20010302