EP 1133786 A2 20010919 - METHODS AND APPARATUS FOR HOLDING AND POSITIONING SEMICONDUCTOR WORKPIECES DURING ELECTROPOLISHING AND/OR ELECTROPLATING OF THE WORKPIECES
Title (en)
METHODS AND APPARATUS FOR HOLDING AND POSITIONING SEMICONDUCTOR WORKPIECES DURING ELECTROPOLISHING AND/OR ELECTROPLATING OF THE WORKPIECES
Title (de)
VERFAHREN UND VORRICHTUNG ZUR HALTERUNG UND POSITIONIERUNG VON HALBLEITERWERKSTÜCKEN BEIM ELEKTROPOLIEREN UND/ODER ELEKTROPLATTIEREN VON HALBLEITERWERKSTÜCKEN
Title (fr)
PROCEDES ET APPAREILS DEUPPORT ET DE POSITIONNEMENT DE PIECES A SEMICONDUCTEURS LORS DE LEUR POLISSAGE ELECTROLYTIQUE ET/OU DE LEUR PLACAGE PAR ELECTRODEPOSITION
Publication
Application
Priority
- US 9928106 W 19991124
- US 11013698 P 19981128
Abstract (en)
[origin: WO0033356A2] A wafer chuck assembly for holding a wafer during electroplating and/or electropolishing of the wafer includes a wafer chuck for receiving the wafer. The wafer chuck assembly also includes an actuator assembly for moving the wafer chuck between a first and a second position. When in the first position, the wafer chuck is opened. When in the second position, the wafer chuck is closed.
IPC 1-7
IPC 8 full level
C25D 7/12 (2006.01); C25D 17/06 (2006.01); C25D 17/08 (2006.01); C25D 21/10 (2006.01); C25F 7/00 (2006.01); H01L 21/288 (2006.01); H01L 21/3063 (2006.01); H01L 21/321 (2006.01); H01L 21/687 (2006.01)
CPC (source: EP KR)
H01L 21/2885 (2013.01 - EP); H01L 21/32115 (2013.01 - EP); H01L 21/68 (2013.01 - KR); H01L 21/68721 (2013.01 - EP); H01L 21/68785 (2013.01 - EP); H01L 21/68792 (2013.01 - EP)
Citation (search report)
See references of WO 0033356A2
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
WO 0033356 A2 20000608; WO 0033356 A3 20010712; WO 0033356 A9 20010802; AU 3105400 A 20000619; CA 2352160 A1 20000608; CN 100382235 C 20080416; CN 1191605 C 20050302; CN 1346510 A 20020424; CN 1632914 A 20050629; EP 1133786 A2 20010919; IL 143316 A0 20020421; IL 143316 A 20050320; JP 2002531702 A 20020924; JP 2007119923 A 20070517; KR 100503553 B1 20050726; KR 100516776 B1 20050926; KR 100562011 B1 20060322; KR 20010086051 A 20010907; KR 20040070317 A 20040806; KR 20050013179 A 20050202; TW 430919 B 20010421
DOCDB simple family (application)
US 9928106 W 19991124; AU 3105400 A 19991124; CA 2352160 A 19991124; CN 200510003773 A 19991124; CN 99813794 A 19991124; EP 99965053 A 19991124; IL 14331699 A 19991124; JP 2000585913 A 19991124; JP 2006315540 A 20061122; KR 20017006569 A 20010525; KR 20047011238 A 19991124; KR 20057000594 A 19991124; TW 88120687 A 19991126